Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
128 words
An RF, EMI shielded integrated circuit package (10) characterized in that it comprises : a plastic substrate (12), an electrically-conductive cup (14) embedded in said substrate (12), said cup having an inwardly-directed lip (16) at the top surface of said substrate, said lip (16) having contact pads (36) thereon insulated from the lip surrounding said pads (36); an electrically-conductive cap (20) electrically and mechanically connected to said lip (16) at a position inward of said contact pads (36) carried by said lip (16); an integrated circuit (22) having contact pads (24), said circuit being positioned within the structure formed by said cap (20) and said lip (16); and means for connecting contact pads (24) on said integrated circuit (22) to said contact pads (36) on said lip (16).
Claim 2
Dependent Claim
128 words
An RF, EMI shielded integrated circuit package (10) characterized in that it comprises : a plastic substrate (12), an electrically-conductive cup (14) embedded in said substrate (12), said cup having an inwardly-directed lip (16) at the top surface of said substrate, said lip (16) having contact pads (36) thereon insulated from the lip surrounding said pads (36); an electrically-conductive cap (20) electrically and mechanically connected to said lip (16) at a position inward of said contact pads (36) carried by said lip (16); an integrated circuit (22) having contact pads (24), said circuit being positioned within the structure formed by said cap (20) and said lip (16); and means for connecting contact pads (24) on said integrated circuit (22) to said contact pads (36) on said lip (16).
Claim 3
Dependent Claim
59 words
The integrated circuit package of claim 1, characterized in that said means for connecting the contact pads (36) on said lip(16) to the contact pads (24) . on said integrated circuit (22) include coaxial cable-like structures embedded in said plastic substrate (12) and running from said lip-carried contact pads (36) to the vicinity of said integrated circuit chip (22).
Claim 4
Dependent Claim
61 words
The integrated circuit package of claim 1, characterized in that said cup (14) has a bottom exposed at the bottom surface of said substrate(12), and further including thermally-conductive columns (26) from the base of said cup (14) to the bottom of said integrated circuit (22), whereby heat generated by said integrated circuit is dissipated by the bottom of said cup (14).
Claim 5
Dependent Claim
32 words
The integrated circuit package of claim 1, characterized in that said cup (14) has a bottom (50) and in that said integrated circuit (22) lies on the bottom of said cup (14).
Claim 6
Dependent Claim
51 words
The integrated circuit package of claim 1, characterized in that said cup (14) has a bottom (50) and in that the bottom surface of said substrate (12) is provided with a thermally conductive layer (62), said thermally conductive layer (62) being in thermal contact with the bottom(50) of said cup (14).
Claim 7
Dependent Claim
26 words
The integrated circuit package of claim 5, characterized in that said integrated circuit package (10) includes heat sink means (64) attached to said thermally-conductive layer (62).
Claim 8
Dependent Claim
21 words
The integrated circuit package of claim 2, characterized in that a portion of said coaxial cable-like structures are rectilinear in form.
Claim 9
Dependent Claim
54 words
The integrated circuit package of claim 1, characterized in that said package (10) is made via multiple laminations of plastic and metal layers, whereby said metal layers may be adapted to form the walls, vias, central conductors of coaxial cable-like elements, the walls for said elements or other conductive buses required for said package.
Claim 10
Dependent Claim
51 words
The integrated circuit package of claim 1, characterized in that said lip (16) includes perforations (70) therethrough, whereby gases formed during the production of said integrated chip package (10) may be released and such that the lip (16) of said cup (14) may be fixedly attached to said plastic substrate (12).
Claim 11
Dependent Claim
27 words
The integrated circuit package of claim 1, characterized in that portions of said package (10) are made with photopatterning steps including chemical developing followed by plasma etching.