Patent US690278A successfully refreshed from Google Patents.
Patent EP0211360A2 successfully refreshed from Google Patents.
EP0211360A2
Expired / Lapsed
EP
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IC card
Assignee: Dai Nippon Printing Co Ltd
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Filing: 1986-07-25
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Granted: —
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Expires: 2006-07-25
Abstract
Abstract The IC card of the present invention comprises an IC card comprising an IC module embedded in a card substrate, said IC card having a reinforcing sheet layer laid in the planar direction of the card so |as to cover at least the peripheral portion of the boundary between the card substrate and the IC module, and/or has a reinforcing member comprising at least a part of the side portion of said IC module extended in the outer circumferential direction, and it is excellent in mechanical strength and flexibility against bending of card.
Inventors
- 👤 Yoshiaki Hida
- 👤 Satoshi Ishihara
- 👤 Seiji Take
- 👤 Masao Gogami
- 👤 Toshiyuki Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 11:29
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; G06K19/07745; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
48 words
An IC card comprisng an IC module embedded in a card substrate, said IC card having a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module.
Claim 2
Dependent Claim
48 words
An IC card comprisng an IC module embedded in a card substrate, said IC card having a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module.
Claim 3
Dependent Claim
53 words
An IC card comprising an IC module comprising an IC chip, a circuit substrate, etc., embedded in an IC module substrate built in a card substrate, said IC module having a reinforcing member comprising at least a part of the side portion of said IC module substrate extended in the outer circumferential direction.
Claim 4
Dependent Claim
53 words
An IC card comprising an IC module comprising an IC chip, a circuit substrate, etc., embedded in an IC module substrate built in a card substrate, said IC module having a reinforcing member comprising at least a part of the side portion of said IC module substrate extended in the outer circumferential direction.
Claim 5
Dependent Claim
41 words
An IC card according to claim 2, wherein a reinforcing sheet layer is laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module.
Claim 6
Dependent Claim
38 words
An IC card according to claim 2 or 3, wherein said reinforcing member is formed in a shape so that it may have a greater area toward the portion with a greater flex coefficient of the IC card.
Claim 7
Dependent Claim
36 words
An IC card according to claim 1, 2 or 3 wherein the sealing frame layer and/or the resin for mold constituting the IC module have/has a color identical or similar to that of a card substrate.
Claim 8
Dependent Claim
23 words
An IC card according to claim 1, 2 or 3, wherein the IC module is applied with smoothening working on the backside thereof.
Claim 9
Dependent Claim
92 words
An IC card according to claim 2 or 3, wherein said IC module is an IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module has a reinforcing member extended in the outer circumferential direction of the IC module, and said reinforcing member is provided as extended so as to form a difference in level from the intermediate portion of said substrate for formation of the IC module.
Claim 10
Dependent Claim
48 words
An IC card according to claim 1, 2 or 3, wherein said IC module comprises two or more IC chips mounted thereon, and the sealing frame layer forming the IC module has windows with shapes for permitting said respective IC chips to extend therethrough independently of each other.
Claim 11
Dependent Claim
31 words
An IC card according to claim 1, 2 or 3, wherein an external terminal of the IC module is formed on the same plane as the surface of the card substrate.
Claim 12
Dependent Claim
45 words
An IC card according to claim 1 or 3, wherein the reinforcing sheet layer is formed of at least one material selected from the group consisting of mesh-like sheet, unwoven fabric, continuous body sheet, rubber sheet, thermoplastice elastomer sheet, rubbery adhesive layer and tacky sheet.
Claim 13
Dependent Claim
31 words
An IC card according to claim 1, or 3, wherein the reinforcing sheet layer comprises an adhesive sheet having a polyolefinic adhesive layer formed on both surfaces of a plastic film.
Claim 14
Dependent Claim
26 words
An IC card according to claim 1 or 3, wherein the reinforcing sheet layer has a color identical or similar to that of the card substrate.
Claim 15
Dependent Claim
19 words
An IC card according to claim 1 or 3, wherein the reinforcing sheet layer comprises an opaque white material.
Claim 16
Dependent Claim
20 words
An IC card according to claim 1, 2 or 3, wherein the oversheet constituting the IC card is opaque white.
Claim 17
Dependent Claim
29 words
An IC card according to claim 1, 2 or 3, wherein the card substrate is constituted with the oversheet having microindentations formed on one surface or both surfaces thereof.
Claim 18
Dependent Claim
27 words
An IC card according to claim 1, 2 or 3, wherein the card substrate is constituted with the oversheet in which a mesh sheet is laid therein.
Claim 19
Dependent Claim
133 words
An IC card comprising an IC module embedded in a card substrate, . said IC card having a mesh sheet as a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module; said IC module being an IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module has a reinforcing member extended in the outer circumferential direction of the IC module; and said reinforcing member being formed in a shape so that it may have greater area toward the portion with greater flex coefficient of the IC card.
Claim 20
Dependent Claim
133 words
An IC card comprising an IC module embedded in a card substrate, . said IC card having a mesh sheet as a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module; said IC module being an IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module has a reinforcing member extended in the outer circumferential direction of the IC module; and said reinforcing member being formed in a shape so that it may have greater area toward the portion with greater flex coefficient of the IC card.
Claim 21
Dependent Claim
51 words
An IC module to be mounted in an IC card, comprising an IC chip, a circuit substrate, etc., embedded in an IC module substrate, said IC module having a reinforcing member comprising at least a part of the side portion of said IC module substrate extended in the outer circumferential direction.
Claim 22
Dependent Claim
51 words
An IC module to be mounted in an IC card, comprising an IC chip, a circuit substrate, etc., embedded in an IC module substrate, said IC module having a reinforcing member comprising at least a part of the side portion of said IC module substrate extended in the outer circumferential direction.
Claim 23
Dependent Claim
34 words
An IC module accoridng to claim 18, wherein said reinforcing member is formed in a shape so that it may have greater area toward the portion with greater flex coefficient of the IC card.
Claim 24
Dependent Claim
22 words
An IC module according to claim 18 or 19, wherein the IC module is applied with smoothening working on the backside thereof.
Claim 25
Dependent Claim
92 words
An IC module according to claim 18 or 19, wherein said IC module is an IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module has a reinforcing member extended in the outer circumferential direction of the IC module, and said reinforcing member is provided as extended so as to form a difference in level from the intermediate portion of said substrate for formation of the IC module.
Claim 26
Dependent Claim
47 words
An IC module according to claim 18 or 19 wherein said IC module comprises two or more IC chips mounted thereon, and the sealing frame layer forming the IC module has windows with shapes for permitting said respective IC chips to extend therethrough independently of each other.
Claim 27
Dependent Claim
32 words
An IC module according to claim 18 or 19, wherein said IC module has a color identical or similar to that of a card substrate in which said IC module is built.
Claim 28
Dependent Claim
36 words
An IC card according to claim 17, wherein said reinforcing member is provided as extended so as to form a difference in level from the intermediate portion of said substrate for formation of the IC module.
Claim 29
Dependent Claim
20 words
An IC card according to claim 24, wherein said IC module is applied with smoothening working on the backside thereof.
References Cited (Backward Citations)
DE3151408C1
Cited
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