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EP0245697A2
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Multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate
Assignee: International Business Machines Corp
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Filing: 1987-04-28
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Granted: —
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Expires: 2007-04-28
Abstract
Abstract A multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate is disclosed. A thin adhesion layer (22), which can suitably be a refractory metal such as titanium, vanadium, chromium or tantalum, is first formed on the surface of the substrate (10). A thick stress reducing layer (24) of soft metal such as copper, silver, nickel, aluminum, gold or iron is subsequently formed over the adhesion layer. To prevent the soft metal from reacting with subsequently brazed gold-tin pin eutectic alloy, a reaction barrier layer (28) which can be titanium or zirconium is then deposited over the soft stress reducing metal cushion layer. The process is completed by finally depositing a gold layer (30) over the reaction barrier layer.
Inventors
- 👤 Anthony Francis Arnold
- 👤 Joseph Alfred Corso
- 👤 Shukla Kapur
- 👤 Walter Frederick Lange
- 👤 Da-Yuan Shih
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 06:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H10; H10W; H10W70/00; H10W70/099; H10W70/60; H10W70/611; H05K1/00; H05K1/02; H05K1/0271; H05K1/03; H05K1/0306; H10W70/62; H10W70/63; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
44 words
A multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate (10) comprising: an adhesion layer (22) deposited on said substrate; a stress reducing layer (24) deposited over said adhesion layer; a titanium barrier layer (28); and a wettable surface (30) layer.
Claim 2
Dependent Claim
44 words
A multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate (10) comprising: an adhesion layer (22) deposited on said substrate; a stress reducing layer (24) deposited over said adhesion layer; a titanium barrier layer (28); and a wettable surface (30) layer.
Claim 3
Dependent Claim
35 words
A multilayered thin film metallurgy on a ceramic substrate comprising: an adhesion layer deposited on said substrate; a stress reducing layer deposited over said adhesion layer; a zirconium barrier layer; and a wettable surface layer.
Claim 4
Dependent Claim
35 words
A multilayered thin film metallurgy on a ceramic substrate comprising: an adhesion layer deposited on said substrate; a stress reducing layer deposited over said adhesion layer; a zirconium barrier layer; and a wettable surface layer.
Claim 5
Dependent Claim
28 words
The multilayered thin film metallurgy as claimed in claim 1 or 2 wherein said adhesion layer is selected from the group consisting of titanium, vanadium, chromium or tantalum.
Claim 6
Dependent Claim
31 words
The multilayered thin film metallurgy as claimed in claim 1 or 2 wherein said stress reducing layer is selected from the group consisting of copper, iron, aluminum, silver, nickel, and gold.
Claim 7
Dependent Claim
28 words
The multilayered thin film metallurgy as claimed in claim 1 or 2 further including a layer of nickel (32) between said barrier layer and said wettable surface layer.
Claim 8
Dependent Claim
28 words
The multilayered thin film metallurgy as claimed in claim 1 or 2 further including a layer of palladium (32) between said barrier layer and said wettable surface layer.
Claim 9
Dependent Claim
19 words
The multilayered thin film metallurgy as claimed in claim 1 or 2 wherein said wettable surface layer is gold.
Claim 10
Dependent Claim
39 words
The multilayered thin film metallurgy as claimed in claim 4 further comprising a phased region (34) between the reaction barrier layer and the wettable surface layer comprised of a mixture of the reaction barrier layer and wettable surface layer.
References Cited (Backward Citations)
No citation records indexed.
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