Package for integrated circuit

Claim 2

A package for an integrated circuit (IC) having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising: a dielectric plate which is provided, on one end face thereof with a grounding conductor and on an opposite end face thereof with said conductor pat­terns, said dielectric plate being provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor.

Claim 3

An IC package according to claim 1, wherein said grounding conductor is composed of a metal plate on which the dielectric plate and the integrated circuit are located.

Claim 4

An IC package according to claim 1 or 2, wherein said dielectric plate is in the form of a hollow frame.

Claim 5

An IC package according to claim 1, 2 or 3,, wherein said conductor patterns are electrically connected to the integrated circuit by lead wires.

Claim 6

An IC package according to any preceding claim , wherein said integrated circuit is directly enclosed by a resin mold.

Claim 7

An IC package according to any preceding claim , further comprising a spacer which is secured to the dielectric plate to surround the integrated circuit and which is sealed by a cap secured to the spacer.

Claim 8

An IC package according to claim 6, wherein said spacer is electrically insulative.

Claim 9

An IC package according to any preceding claim , wherein said dielectric plate has through holes in which the conductor poles are buried.

Claim 10

An IC package according to any preceding claim , wherein said conductor poles are regularly arranged between the adjacent conductor patterns.

Claim 11

An IC package according to any preceding claim , further comprising leads which are connected to the conductor patterns provided on the dielectric plate by a predetermined pattern of brazing having a width that is the same as that of the corresponding leads.

Claim 12

A package for an integrated circuit, having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising: a first dielectric plate which is pro­vided on one end face thereof with a grounding conductor and on an opposite end face thereof with said conductor patterns, said first dielectric plate being provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor; and, a second dielectric plate which is located on the conductor patterns of the first dielectric plate and which is provided with conductor poles which are electrically connected at least partially to the conductor poles of the first dielectric plate.

Claim 13

A package for an integrated circuit, having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising: a first dielectric plate which is pro­vided on one end face thereof with a grounding conductor and on an opposite end face thereof with said conductor patterns, said first dielectric plate being provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor; and, a second dielectric plate which is located on the conductor patterns of the first dielectric plate and which is provided with conductor poles which are electrically connected at least partially to the conductor poles of the first dielectric plate.

Claim 14

A package for an integrated circuit, having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising: a first dielectric plate which is provided on one end face thereof with a grounding conductor and on an opposite end face thereof with said conductor patterns, said first dielectric plate being provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor; and, a second dielectric plate which is located on the conductor patterns of the first dielectric plate and which is provided, on an end face far from the first dielectric plate, with a conductive film, said second dielectric plate being provided with conductor poles which are connected to the conductive film and which are electrically connected at least partially to the conductor poles of the first dielectric plate.

Claim 15

A package for an integrated circuit, having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit, comprising: a first dielectric plate which is provided on one end face thereof with a grounding conductor and on an opposite end face thereof with said conductor patterns, said first dielectric plate being provided with conductor poles which are located between the conductor patterns and which extend through the thickness of the dielectric plate to be connected to the grounding conductor; and, a second dielectric plate which is located on the conductor patterns of the first dielectric plate and which is provided, on an end face far from the first dielectric plate, with a conductive film, said second dielectric plate being provided with conductor poles which are connected to the conductive film and which are electrically connected at least partially to the conductor poles of the first dielectric plate.

Claim 16

An IC package according to claim 12, further comprising a conductive cap which is secured and electri­cally connected to the conductive film provided on the second dielectric plate to enclose the integrated circuit.

Claim 17

An IC package according to claim 12 or 13, wherein said conductor poles provided in the second dielectric plate coaxially extend through the first and second dielectric plates.

Claim 18

An IC package according to claim 14, wherein said conductor poles formed in the second dielectric plate are in alignment with the corresponding conductor poles formed in the first dielectric plate so as to establish an electrical connection therebetween.

Claim 19

An IC package according to any one of claims 12 to 15, wherein said conductor poles are regularly arranged between the adjacent conductor patterns formed in the first dielec­tric plate.

Claim 20

An IC package according to any one of claims 12 to 16, wherein said grounding conductor is composed of a metal plate on which the dielectric plate and the integrated circuit are located.

Claim 21

An IC package according to any one of claims 12 to 17, wherein said first and second dielectric plates are in the form of hollow frames.

Claim 22

An IC package according to any one of claims 12 to 18, wherein said conductor patterns are electrically connected to the integrated circuit by lead wires.

Claim 23

An IC package according to any one of claims 12 to 19, wherein said first and second dielectric plate have through holes in which the conductor poles are buried.

Claim 24

An IC package according to any one of claims 12 to 20, further comprising additional conductor patterns for connecting the conductor poles, disposed parallel to the conductor patterns provided on the first dielectric plate.

Claim 25

An IC package according to any one of claims 12 to 21, further comprising leads which are connected to the conductor pattern provided on the first dielectric plate by a predetermined patterns of brazing having a width that is the same as that of the corresponding leads.

Claim 26

A package for an integrated circuit, comprising a grounding metal base, a first dielectric frame which is located on the metal base and which is provided, on an end face far from the metal base, with conductor patterns having a plurality of bar-like patterns located side by side, said first dielectric frame being provided, between the adjacent conductor patterns, with through holes in which conductor poles are buried, a second dielectric frame which is located on the conductor patterns of the first dielectric frame and which has, on an end face far from the first dielectric frame, a conductive film which can be made molten by heating, said second dielectric frame being provided with other through holes corresponding to the through holes provided in the first dielectric frame and below the second dielectric frame, said other through holes being filled with conductor poles which are electrically connected to the corresponding conductor poles provided in the first dielectric frame, and a conductive cap which is put on and connected to the conductive film provided on the second dielectric frame, so that the cap is electrically connected to the grounding base through the conductor poles provided in the first and second dielectric frames.

Claim 27

A package for an integrated circuit, comprising a grounding metal base, a first dielectric frame which is located on the metal base and which is provided, on an end face far from the metal base, with conductor patterns having a plurality of bar-like patterns located side by side, said first dielectric frame being provided, between the adjacent conductor patterns, with through holes in which conductor poles are buried, a second dielectric frame which is located on the conductor patterns of the first dielectric frame and which has, on an end face far from the first dielectric frame, a conductive film which can be made molten by heating, said second dielectric frame being provided with other through holes corresponding to the through holes provided in the first dielectric frame and below the second dielectric frame, said other through holes being filled with conductor poles which are electrically connected to the corresponding conductor poles provided in the first dielectric frame, and a conductive cap which is put on and connected to the conductive film provided on the second dielectric frame, so that the cap is electrically connected to the grounding base through the conductor poles provided in the first and second dielectric frames.