Patent EP0307665A2 successfully refreshed from Google Patents.
EP0307665A2
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Encapsulation composition and use thereof
Assignee: International Business Machines Corp
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Filing: 1988-08-23
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Granted: —
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Expires: 2008-08-23
Abstract
Abstract A composition capable of encapsulating electronic devices that includes a cycloaliphatic epoxide; an anhydride of an organic carboxylic acid; and an alkylene oxide adduct of an imidazole, and use thereof to encapsulate an electronic device by reaction injection molding.
Inventors
- 👤 Stephen Leslie Buchwalter
- 👤 Caroline Ann Kovac
- 👤 Luu Thanh Nguyen
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 17:46
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/22; C08G59/24; C08G59/40; C08G59/42; C08G59/68; C08G59/686
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
59 words
A composition comprising: a) cycloaliphatic epoxide, b) an anhydride of carboxylic acid in an amount sufficient to harden said cycloaliphatic epoxide; c) an alkylene oxide adduct of an imidazole in an amount sufficient to promote the harding of said cycloaliphatic epoxide, and d) optionally a filler and/or a reactive modifier to impart desirable mechanical properties to the cured composition.
Claim 2
Dependent Claim
59 words
A composition comprising: a) cycloaliphatic epoxide, b) an anhydride of carboxylic acid in an amount sufficient to harden said cycloaliphatic epoxide; c) an alkylene oxide adduct of an imidazole in an amount sufficient to promote the harding of said cycloaliphatic epoxide, and d) optionally a filler and/or a reactive modifier to impart desirable mechanical properties to the cured composition.
Claim 3
Dependent Claim
42 words
Composition according to claim 1 wherein said cycloaliphatic epoxide is selected from the group of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate; bis(3,4-epoxy-6-methyl-cyclohexylmethyl) adipate; bis(3,4-epoxycyclohexylmethlyl) adipate; bis(2,3-epoxycyclopentyl) ether, vinyl cyclohexane diepoxide; 2-(3,4-epoxycyclohexyl)-5,5-spiro(2,3-epoxycyclohexane)-m-dioxane; 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-m-dioxane; bis(3,4-epoxycyclohexyl) adipate; and mixtures thereof with 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate being most preferred.
Claim 4
Dependent Claim
16 words
Composition according to claim 1 or 2 wherein said anhydride is liquid at normal room temperature.
Claim 5
Dependent Claim
44 words
Composition according to any one of claims 1 to 3 wherein said anhydride is selected from the group of methyltetrahydrophthalic anhydride; hexahydrophthalic anhydride; tetrahydrophthalic anhydride; phthalic anhydride; norbornene dicarboxylic anhydride; nadic methyl anhydride; methylcyclohexane-1,2-dicarboxylic anhydride; and mixtures thereof with methylcyclohexane-1,2-dicarboxylic anhydride being most preferred.
Claim 6
Dependent Claim
39 words
Composition according to any one of claims 1 to 4 wherein the amount of said anhydride is about 20% to about 120% and preferably about 75% to about 100% by equivalents of the epoxide equivalent of the cycloaliphatic epoxide.
Claim 7
Dependent Claim
22 words
Composition according to any one of claims 1 to 5 wherein said alkylene oxide is propylene oxide and said imidazole is imidazole.
Claim 8
Dependent Claim
37 words
Composition of claim 1 wherein the amount of said adduct is about 0.1% to about 10% by weight and preferably about 1% to about 5% by weight of the total weight of said epoxide, anhydride, and adduct.
Claim 9
Dependent Claim
31 words
Composition according to any one of claims 1 to 7 having a viscosity of about 0.1 Pas to about 1 Pas (about 100 centipoise to about 1,000 centipoise) at about 25°C.
Claim 10
Dependent Claim
51 words
An electronic device encapsulated in a cured composition obtained from a formulation comprising: a) cycloaliphatic epoxide; b) an anhydride of carboxylic acid in an amount sufficient to harden said cycloaliphatic epoxide; and c) an alkylene oxide adduct of an imidazole in an amount sufficient to promote hardening of said cycloaliphatic epoxide.
Claim 11
Dependent Claim
51 words
An electronic device encapsulated in a cured composition obtained from a formulation comprising: a) cycloaliphatic epoxide; b) an anhydride of carboxylic acid in an amount sufficient to harden said cycloaliphatic epoxide; and c) an alkylene oxide adduct of an imidazole in an amount sufficient to promote hardening of said cycloaliphatic epoxide.
Claim 12
Dependent Claim
97 words
A process for encapsulating an electronic device by reaction injection molding which comprises providing an electronic device in a mold; providing an encapsulating composition comprising: a) cycloaliphatic epoxide; b) an anhydride of carboxylic acid in an amount sufficient to harden said cycloaliphatic epoxide; c) an alkylene oxide adduct of an imidazole in an amount sufficient to promote the harding of said cycloaliphatic epoxide, introducing said encapsulating composition into said mold; and permitting said encapsulating composition to harden and thereby obtain an encapsulated electronic device; and optionally subjecting said encapsulating composition to post-curing after removal from said mold.
Claim 13
Dependent Claim
97 words
A process for encapsulating an electronic device by reaction injection molding which comprises providing an electronic device in a mold; providing an encapsulating composition comprising: a) cycloaliphatic epoxide; b) an anhydride of carboxylic acid in an amount sufficient to harden said cycloaliphatic epoxide; c) an alkylene oxide adduct of an imidazole in an amount sufficient to promote the harding of said cycloaliphatic epoxide, introducing said encapsulating composition into said mold; and permitting said encapsulating composition to harden and thereby obtain an encapsulated electronic device; and optionally subjecting said encapsulating composition to post-curing after removal from said mold.
Claim 14
Dependent Claim
26 words
Process according to claim 10 wherein the pressure in said mold is about 1,723.5 mbar to about 3,447 mbar (about 25 psi to about 50 psi).
Claim 15
Dependent Claim
26 words
Process according to claim 10 or 11 wherein the temperature in said mold is about 100°C to about 200°C and preferably about 130°C to about 160°C.
Claim 16
Dependent Claim
33 words
Process according to any one of claims 10 to 12 wherein the time in said mold is about 1 minute to about 10 minutes and preferably about 1 minute to about 5 minutes.
References Cited (Backward Citations)
No citation records indexed.
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