Patent EP0329133A2 successfully refreshed from Google Patents.
EP0329133A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Flip substrate for chip mount
Assignee: Microelectronics and Computer Technology Corp
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Filing: 1989-02-16
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Granted: —
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Expires: 2009-02-16
Abstract
Abstract A substrate (30) for attaching electrical devices (42) having an interconnect wiring structure (34) and a support (32) for the interconnect, the support having a number of vias (38), or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more densely since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.
Inventors
- 👤 Davis Harrison Carey
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 07:38
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/685; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
57 words
A substrate for attaching electrical devices, comprising, a wiring interconnect; and a support structure for supporting said interconnect, which includes means on one side thereof for attaching to said interconnect, means on the other side thereof for attaching to electric devices, and a plurality of vias extending therethrough and electrically connecting said interconnect and said electric devices.
Claim 2
Dependent Claim
57 words
A substrate for attaching electrical devices, comprising, a wiring interconnect; and a support structure for supporting said interconnect, which includes means on one side thereof for attaching to said interconnect, means on the other side thereof for attaching to electric devices, and a plurality of vias extending therethrough and electrically connecting said interconnect and said electric devices.
Claim 3
Dependent Claim
15 words
A substrate as claimed in Claim 1, wherein said vias are arranged in a grid.
Claim 4
Dependent Claim
27 words
A substrate as claimed in Claim 1, wherein said vias are arranged to align with bondsites of integrated circuit chips positioned about the periphery of said chips.
Claim 5
Dependent Claim
18 words
A substrate as claimed in Claim 1, wherein said support comprises means for attachment to integrated circuit chips.
Claim 6
Dependent Claim
17 words
A substrate as claimed in Claim 1, wherein said vias are filled with an electrically conductive material.
Claim 7
Dependent Claim
17 words
A substrate as claimed in Claim 1, wherein said vias are lined with an electrically conductive material.
Claim 8
Dependent Claim
14 words
A substrate as claimed in Claim 1, further comprising at least one reference plane.
Claim 9
Dependent Claim
14 words
A substrate as claimed in Claim 1, further comprising at least one voltage plane.
Claim 10
Dependent Claim
18 words
A substrate as claimed in Claim 8, wherein at least one voltage plane is positioned in said support.
Claim 11
Dependent Claim
18 words
A substrate as claimed in Claim 8, wherein at least one voltage plane is positioned in said interconnect.
Claim 12
Independent Claim
44 words
A method for attaching devices to a substrate, comprising the step of attaching an electrical device to a substrate at at least one via extending through the substrate, said via being electrically connected to an interconnect structure on the opposite side of said substrate.
Claim 13
Independent Claim
44 words
A method for attaching devices to a substrate, comprising the step of attaching an electrical device to a substrate at at least one via extending through the substrate, said via being electrically connected to an interconnect structure on the opposite side of said substrate.
References Cited (Backward Citations)
No citation records indexed.
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