Process for mounting electronic micro components on a support, and intermediate product

Abstract

Abstract Translated from French Le procédé permet de monter, sur un support de circuit imprimé, des micro-composants électroniques, notamment des porte-puce, munis, sur leur face inférieure, de contacts soudables (20). On fixe à plat le micro-composant au support par l'intermédiaire d'une cale (24) en un matériau ayant un coefficient de dilatation comparable à celui du micro-composant. On relie les contacts (20) du micro-composant au circuit imprimé par des tronçons (22) de fil souple présentant une courbure suffisante pour assurer un découplage mécanique. The method makes it possible to mount, on a printed circuit support, electronic micro-components, in particular chip holders, provided, on their underside, with weldable contacts (20). The micro-component is fixed flat to the support by means of a wedge (24) made of a material having a coefficient of expansion comparable to that of the micro-component. The contacts (20) of the micro-component are connected to the printed circuit by sections (22) of flexible wire having sufficient curvature to ensure mechanical decoupling.

Inventors

• 👤 Jacques De Givry
• 👤 Jean-Claude Vallet
• 👤 Jean-Paul Lalfer

Bibliographic Details