Abstract A ceramic package component has a base portion (10) and an upstanding enclosing wall (16) on the base portion (10), the upper surface (18) of the wall (16) being provided with an electrically conductive coating (17) in order to receive a lid sealingly thereon. The electrically conductive coating (17) on the upper surface of the wall (16) is electrically connected to a further conductive coating (21) on the undersurface of the base portion (10) by means of a high density array of conductive vias (22) extending through the wall (16). The inter via spacing between adjacent vias (22) is preferably less than one quarter of the wavelength of the frequency at which the component is to operate.
A ceramic package component comprising a base portion (10) and an upstanding enclosing wall (16) on the base portion (10), the upper surface (18) of the wall being provided with an electrically conductive coating (17) in order to receive a lid sealingly thereon, characterised in that said electrically conductive coating (11) on the upper surface (18) of the wall is electrically connected to a further conductive coating (21) on the undersurface of the base portion (10) by means of a high density array of conductive vias (22) extending through the height of the wall.
Claim 2
Dependent Claim
94 words
A ceramic package component comprising a base portion (10) and an upstanding enclosing wall (16) on the base portion (10), the upper surface (18) of the wall being provided with an electrically conductive coating (17) in order to receive a lid sealingly thereon, characterised in that said electrically conductive coating (11) on the upper surface (18) of the wall is electrically connected to a further conductive coating (21) on the undersurface of the base portion (10) by means of a high density array of conductive vias (22) extending through the height of the wall.
Claim 3
Dependent Claim
41 words
A ceramic package component as claimed in claim 1, wherein the inter via spacing between adjacent vias (22) in the high density array is less than one quarter of the wavelength of the frequency at which said component is to operate.
Claim 4
Dependent Claim
15 words
A ceramic package comprising a ceramic package component as claimed in claim 1 or 2.
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