Collimated deposition apparatus and method
Abstract
Abstract Sputtering apparatus and method which are particularly suitable for forming step coatings. A workpiece (W) is supported in a chamber (17), particles are emitted from a sputter source (26) in a substantially uniform manner throughout an area of greater lateral extent than the workpiece, the pressure within the chamber is maintained at a level which is sufficiently low to prevent substantial scattering of the particles between the source and the workpiece, and the particles are passed through a collimating filter (63) having a plurality of transmissive cells with a length to diameter ratio on the order of 1:1 to 3:1 positioned between the source and the workpiece to limit the angles at which the particles can impinge upon the workpiece.
Inventors
- 👤 Richard Ernest Demaray
- 👤 John C Helmer
- 👤 Young Hoon Park
- 👤 Ronald R Cochran
- 👤 Vance Eber Hoffman Jr
Bibliographic Details
Claims Analysis
Total Claims: 10References Cited (Backward Citations)
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