Patent US1781768A successfully refreshed from Google Patents.
Patent EP0528367A1 successfully refreshed from Google Patents.
EP0528367A1
Expired / Lapsed
EP
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Three-dimensional multi-chip module
Assignee: Fujitsu Ltd
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Filing: 1992-08-13
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Granted: —
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Expires: 2012-08-13
Abstract
Abstract A three-dimensional multi-chip module having a high integration density and a high power output in accordance with the present invention comprising: a substrate (2) having wiring patterns with a plurality of electrode terminals (21), at least a single semiconductor element (10a) arranged facedown on the bottom surface of the substrate (2) and operatively connected to the electrode terminals (21), at least a single semiconductor element (10b) and/or passive element (6) arranged on the front surface of the substrate (2) and operatively connected to the electrode terminals (21), a heat conductive base (4) facing the bottom surface of the substrate (2) and thermally in contact with the back surface of the semiconductor element (2) arranged on the bottom surface of the substrate (2), a support base (3), a cap (7) and a heat sink (5), thereby the heat conductive base (4), the support base (3) and the cap (7) forming an enclosure of the substrate (2).
Inventors
- 👤 Masataka c/o Fujitsu Limited Mizukoshi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 13:54
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W90/00; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W90/20; H10W90/22; H10W90/288; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
136 words
A multi-chip module having a plurality of semiconductor elements arranged three-dimensionally, said multi-chip module comprising: a substrate (2) having a first surface and a second surface, and wiring patterns including a plurality of electrode terminals (21) formed on the first and second surfaces respectively, at least a single semiconductor element (10a) arranged facedown on the first surface of the substrate (2) and operatively connected to the electrode terminals (21) on the first surface, at least a single semiconductor element (10b) arranged on the second surface of the substrate (2) and operatively connected to the electrode terminals (21) on the second surface, and a heat conductive base (4) facing the first surface of the substrate and thermally in contact with a back surface of the semiconductor element (10a) arranged on the first surface of the substrate (2).
Claim 2
Dependent Claim
92 words
A multi-chip module as recited in claim 1, said multi-chip module further comprising: a support base (3) having a plurality of outer leads (12) and a plurality of electrode terminals operatively connected to the outer leads (12) and having an opening for accepting said substrate (2) with the semiconductor elements (10a,10b) therein, thereby the electrode terminals on the support base (3) being operatively connected to said electrode terminals on the substrate (2) and an end surface of the support base (3) being fixed to the periphery of said heat conductive base (4).
Claim 3
Dependent Claim
54 words
A multi-chip module as recited in claim 2, said multi-chip module further comprising: a cap (7) disposed on said support base (3) facing the second surface of the substrate (2), thereby said heat conductive base (4), said support base (3) and the cap (7) forming an enclosure inside which said substrate (2) is disposed.
Claim 4
Dependent Claim
28 words
A multi-chip module as recited in anyone of claims 1 to 3, said multi-chip module further comprising: a heat sink (5) for cooling said heat conductive base (4).
Claim 5
Dependent Claim
50 words
A multi-chip module as recited in anyone of claims 1 to 4, wherein said semiconductor element (10a) on the first surface of the substrate (2) is the one whose heat dissipation is large and said semiconductor element (10b) on the second surface is the one whose heat dissipation is small.
Claim 6
Dependent Claim
30 words
A multi-chip module as recited in anyone of claims 1 to 5, said multi-chip module further comprising: a passive element (6) arranged on the second surface of the substrate (2).
Claim 7
Dependent Claim
33 words
A multi-chip module as recited in anyone of claims 1 to 6, wherein material of said heat conductive base (4) has a thermal expansion coefficient close to that of the semiconductor element (2).
Claim 8
Dependent Claim
25 words
A multi-chip module as recited in anyone of claims 2 to 7, wherein said substrate (2) and said support base (3) are made of ceramic.
Claim 9
Dependent Claim
43 words
A multi-chip module as recited in anyone of claims 3 to 8, said multi-chip module further comprising: an elastic metal member (9) of heat conductive material inserted between the second surface of said substrate (2) and the inside surface of said cap (7).
Claim 10
Dependent Claim
60 words
A multi-chip module as recited in claim 9, wherein one and (9a) of said metal member (9) is fixed to the inside surface of the cap (7), the other end (9b) thereof is movable in contact with the inside surface of the cap (7), and the middle portion thereof is in contact with said second surface of the substrate (2).
Claim 11
Dependent Claim
52 words
A multi-chip module as recited in anyone of claims 1 to 10, wherein said wiring pattern further comprises test terminals (22), whereby the test terminals (22) are used for testing each circuit block of a subassembly composed of said semiconductor elements (10a,10b) and the substrate (2) before packaging into the multi-chip module.
References Cited (Backward Citations)
EP0264469A1
Cited
FR2630859A1
Cited
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