TIGHTENING CHUCK FOR SEMICONDUCTOR WAFER

Abstract

Abstract Translated from French LA PLAQUETTE 11 EST SERREE PAR SON BORD CONTRE LA FACE BOMBEE 15 D'UNE PLAQUE D'APPUI 13 CIRCULAIRE, LAQUELLE EST PERCEE DE CANAUX 23, 27-31 ET COMPORTE UNE GORGE ANNULAIRE 25, QUI PERMETTENT DE FAIRE PASSER UN GAZ SOUS UNE PRESSION DETERMINEE DANS L'INTERSTICE SUBSISTANT ENTRE CETTE PLAQUETTE 11 ET CETTE FACE BOMBEE 15. UNE GORGE ANNULAIRE 37 DE LA PERIPHERIE DE LADITE FACE BOMBEE COMMUNIQUE AVEC UNE POMPE A VIDE, QUI ASPIRE LE GAZ EN MINIMISANT LES FUITES DE CE GAZ VERS L'ENCEINTE. APPLICATION NOTAMMENT AU TRAITEMENT SOUS VIDE APPLIQUANT ET DEGAGEANT BEAUCOUP D'ENERGIE, DE PLAQUETTES SEMI-CONDUCTRICES A CIRCUITS INTEGRES. THE PLATE 11 IS CLOSED BY ITS EDGE AGAINST THE BUCKED FACE 15 OF A CIRCULAR BACKING PLATE 13, WHICH IS BORED BY CHANNELS 23, 27-31 AND HAS AN ANNULAR THROAT 25, WHICH ALLOWS GAS TO PASS UNDER PRESSURE DETERMINED IN THE INTERSTICE EXISTING BETWEEN THIS PLATE 11 AND THIS BOMBED FACE 15. AN ANNULAR THROAT 37 OF THE PERIPHERY OF THE SAID BOMBED FACE COMMUNICATES WITH A VACUUM PUMP, WHICH INTAKES THE GAS MINIMIZING THE LEAKS OF THIS GAS TO THE CONTAINER. APPLICATION ESPECIALLY TO VACUUM TREATMENT APPLYING AND RELEASING A LOT OF ENERGY, OF SEMICONDUCTOR PACKAGES WITH INTEGRATED CIRCUITS.

Inventors

• 👤 Morgan Jay Morley

Bibliographic Details