Semiconductor device

Abstract

Abstract PURPOSE:To prevent a resin from flowing into a through hole by a method wherein the opening end part of the through hole is blocked up by using a coating hardened layer of an organic compound resist. CONSTITUTION:A coating hardened layer 17 of a resist ink is formed on a circuit board 10 around a semiconductor chip 13. The opening end on the surface side of through holes 12 is blocked up completely. Thereby, it is possible to prevent that an epoxy-resin sealing layer 18 formed at the upper part flows into the holes 12. Since the layer 18 is formed by a transfer molding method, pads 14 of an inserted semiconductor chip 13 and connecting wires 16 are not carried away by a pressed-into resin and are not destroyed and a good characteristic can be obtained.

Inventors

• 👤 Kazuhiko Tokumaru
• 👤 徳丸　和彦

Bibliographic Details