Patent JPS54974A successfully refreshed from Google Patents.
JPS54974A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Manufacture for semiconductor device
Assignee: NEC Corp
•
Filing: 1977-06-06
•
Granted: —
•
Expires: 1997-06-06
Abstract
Abstract PURPOSE: To improve the workability of chipping for semicondcutor substrate, by using thick film of dry type photo sensitive resin having adhesion and photo polymerzation. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Masaru Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 16:25
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.