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Patent JPS5772352A successfully refreshed from Google Patents.
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JPS5772352A Expired / Lapsed JP ⏱️ 0.0 years remaining

Lead out electrode

Assignee: Toshiba Corp
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Filing: 1980-10-23
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Granted: —
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Expires: 2000-10-23
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Abstract

Abstract PURPOSE:To improve electric conductivity and strength of a lead out electrode to enhance its reliability as well as to raise its production yield by laying only barrier metal layer in a contact hole etched away in a protective layer. CONSTITUTION:A wiring layer 11 with a fixed pattern is formed on a substrate 10. An adhesion metal layer 12 made of Cr and others is selectively laid on the wiring layer 11. Then, a protective layer 13 is convered on it, and after that a contact hole 14 connecting with the adhesion metal layer 12 is etched away in the protective layer. Subsequently, a barrier metal layer 15 made of copper and others is formed on the surface of adhesion metal layer 12 and the whole surface of protective layer 13. A resist layer 18 is coated on the surface of barrier metal layer 15, and a contact hole is etched away in this resist layer 18. Next, a gold bump 16 is built on the resist layer 18. Afterwards, the resist layer 18 is etched away, and the barrier metal 15 is patterned.

Inventors

  • 👤 Kazuo Sato

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 23:40
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/251

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