JPS58118A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Method of laser trimming element on semiconductor substrate
Assignee: Analog Devices Inc
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Filing: 1982-06-09
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Granted: —
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Expires: 2002-06-09
Abstract
Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Inventors
- 👤 ジエロ−ム・エフ・ラフアム
- 👤 トミ−・デイ・クラ−ク
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-08 07:30
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/22; H01C17/24; H01C17/242
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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