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JPS58118A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method of laser trimming element on semiconductor substrate

Assignee: Analog Devices Inc
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Filing: 1982-06-09
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Granted: —
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Expires: 2002-06-09
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Abstract

Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Inventors

  • 👤 ジエロ−ム・エフ・ラフアム
  • 👤 トミ−・デイ・クラ−ク

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-08 17:26
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/22; H01C17/24; H01C17/242

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