Sealing method for hybrid integrated circuit

Abstract

Abstract PURPOSE:To attach epoxy resin to the whole, and to seal titled circuit completely by sticking silicon resin onto a circuit element through screen printing and sealing the whole with epoxy resin powder. CONSTITUTION:A conductor formed by screen-printing conductor paints to one main surface of a substrate 10 and a carbon resistor shaped by screen-printing and baking resistance paints are molded, and a transistor and the IC are fixed onto the conductor. The silicon resin 12 is selectively screen-printed and attached onto the circuit elements 11. The powder of the epoxy resin 13 is blown against the whole and heated and cured, and the whole is sealed with the epoxy resin 13.

Inventors

• 👤 Akira Kazami
• 👤 風見　明
• 👤 Takeo Kondo
• 👤 近藤　武雄

Bibliographic Details