Semiconductor device

Abstract

Abstract PURPOSE:To obtain specified brazing strength without deterioration of electrical and mechanical characteristics by providing a metal which is easily wet by brazing material at the brazing area and by providing a means for repelling the brazing material to the brazing-free area. CONSTITUTION:On the occasion of coupling a stad 16 and an insulated wall member 17, for example, with the Silver-Copper eutectic braze 14, the surface of stad 16 is plated by the Ni 15, for example, which is easily wet by the braze 14, the Ni 15 is partly removed exposing the surface of stad 16 which repels the braze and a groove 21 or extrusion 22 is provided therein. Thereby, the fitting area of semiconductor element is not in contact with the brazing material at the wall member fitting area. Accordingly, corrosion of brazing material and deterioration of coupling by chemical reactions based on mixture of them can be prevented and the specified brazing strength can be acquired easily.

Inventors

• 👤 Shinzo Anazawa
• 👤 穴沢　信造

Bibliographic Details