Magnetic bubble memory device
Abstract
Abstract PURPOSE:To widen temperature range in which stable operation is obtained, by changing mechanically inclination of a base plate to a bias magnet and a homogenizer according to temperature change utilizing difference of the thermal expansion coefficient of two kinds of molding resin largely different in the thermal expansion coefficient. CONSTITUTION:After mounting a magnetic bubble chip 12 on a base plate 11, the chip 12 and the terminal of the base plate 11 is bonded with a wire 15. An X-coil 16 and a Y-coil 17, intersecting at right angles, are fixed into the base plate 11, and the base plate 11 is fixed through a lead wire 19. Silicone resin 13 and epoxy resin 14 are inserted in the periphery of the base plate 11 in a frame 18. Before hardening, a homogenizer 20 having small holding power and magnetically soft, and a bias magnet 21 are attached above and below the base plate 11, and each resin 13, 14 is heat cured to complete a device fixed to a shield case 22. Since the thermal expansion coefficients of resin 13, 14 are different, inclination of the base plate 11 changes with temperature, and range of stable operation is widened.
Inventors
- 👤 Itaru Otake
- 👤 大竹 格
Bibliographic Details
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