Resin sealed type semiconductor device and resin sealing method thereof

Abstract

Abstract PURPOSE:To prevent the short-circuit trouble occurring when a semiconductor device is attached to a heat radiating fin by a method wherein a stepping is provided in such a manner that the lower surfaces of an external connection lead and the extended part of a heat radiating plate are positioned above the upper surface of the heat radiating plate. CONSTITUTION:As the extended part 22 of a heat radiating plate has a stepping which is positioned at the part higher than a heat radiating plate 19, its circumference is coated by resin material 29, and a metal is not protruded toward outside from the resin material, excluding an external connection terminal, the short-circuit trouble occurring when the semiconductor device is attached to the heat radiating fin can be prevented. Also, a metal part on the circumference of a notched part is exposed because it is not completely covered by the resin material 29, but as the extended part 22 is positioned at the part located higher than the heat radiating plate 19, the insulation distance between the notched part 23, attached to the heat radiating fin, and the heat radiating fin can be made longer.

Inventors

• 👤 Shiyuuichirou Kuneta
• 👤 久祢田　修一郎

Bibliographic Details