Semiconductor device with stress resistant support for semiconductor disc

Claim 1

IN AN ENCLOSED SEMICONDUCTOR ARRANGEMENT THE COMBINATION COMPRISING A METAL CASING PART, UPPER AND LOWER CERAMIC TUBES ARRANGED IN SUPERPOSED CONCENTRIC RELATION ON SAID METAL CASING PART, AN ELONGATED CONDUCTIVE CONNECTING MEMBER EXTENDING THROUGH THE INTERIOR OF SAID CERAMIC TUBES, AN UPPER METAL SLEEVE SURROUNDING SAID CONNECTING MEMBER, SAID UPPER SLEEVE BEING SOLDERED PERIPHERALLY TO THE UPPER CERAMIC TUBE AND CONNECTING MEMBER TO FORM A SEALED JOINT CLOSING OFF THE UPPER END OF THE UPPER CERAMIC TUBE, A LOWER SLEEVE PERIPHERALLY SOLDERED TO SAID METAL CASING PART AND THE LOWER END OF SAID LOWER CERAMIC TUBE, A SEMICONDUCTOR ELEMENT SUPPORTED ON SAID METAL CASING PART AND A FUNNEL-SHAPED METAL MEMBER HAVING AN UPPER PERIPHERAL FLANGE SECURED BETWEEN THE CONFRONTING END WALLS OF SAID SUPERPOSED CERAMIC TUBES, THE LOWER PORTION OF SAID FUNNEL-SHAPED MEMBER TERMINATING IN A FLAT SURFACE IN ABUTMENT WITH SAID SEMICONDUCTOR ELEMENT.