Patent US973965A successfully refreshed from Google Patents.
Patent US3607240A successfully refreshed from Google Patents.
US3607240A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder for contacting a semiconductor body and method for its production
Assignee: Siemens AG
•
Filing: 1969-07-23
•
Granted: 1971-09-21
•
Expires: 1989-07-23
Abstract
Abstract A solder for contacting a semiconductor body with a contact piece, whereby silicon constitutes an alloying component of the semiconductor body. The solder composition is: Pdx ((MeIyMeII1 y)z Si1 z)1 x WITH 0.25 X 0.60 0.20 Y 0.90 0.05 Z 0.35 WHEREIN MeI is molybdenum or tungsten and MeII is iron, nickel, or cobalt.
Inventors
- 👤 Alfred Kunert
- 👤 Gerhard Oesterhelt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:34
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/32; B23K35/322
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
30 words
The solder of claim 1, wherein the mixing ratio of the solder components MeI and MeII corresponds, at least approximately, to an eutectic or dystectic point of the melt diagram.
Claim 2
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.3 ((Mo0.37 Fe0.63)0.1 Si0.9)0.7 .
Claim 3
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.38 ((W0.46 Co0.54)0.1 Si0.9)0.62 .
Claim 4
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.44 ((W0.6 Co0.4)0.12 Si0.88)0.56 .
Claim 5
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.55 ((W0.75 Co0.25)0.2 Si0.8)0.45 .
Claim 6
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.38 ((W0.5 Ni0.5)0.1 Si0.9)0.62 .
Claim 7
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.38 ((Mo0.46 Co0.54)0.1 Si0.9)0.62 .
Claim 8
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.44 ((Mo0.6 Co0.4)0.1 Si0.9)0.56 .
Claim 9
Dependent Claim
23 words
The solder of claim 2, whereby the solder used to contact a GeSi semiconductor body, has the composition: Pd0.35 ((Mo0.75 Co0.25)0.18 Si0.82)0.65 .
Claim 10
Dependent Claim
23 words
The solder of claim 2, whereby tHe solder used to contact a GeSi semiconductor body, has the composition: Pd0.3 ((Mo0.67 Ni0.33)0.13 Si0.87)0.7 .
Claim 11
Dependent Claim
50 words
The method of producing a solder of claim 1 which comprises melting together the metals MeI and MeII in an appropriate mixing ratio, subsequently melting the dimetal alloy and silicon, at least once, in an appropriate mixing ratio and during the last melting process adding the respective share of palladium.
Claim 12
Dependent Claim
44 words
The method of claim 12, wherein the dimetal alloy and the silicon are placed into a perpendicularly positioned melting tube, which is sealed at the bottom, and inductively melted with a high frequency field and the melting tube is rotated around the tubular axis.
Claim 13
Dependent Claim
29 words
The method of claim 13, wherein during the solidification of the melt, the melting tube is lowered from the high frequency field, in the direction of the tubular axis.
Claim 14
Dependent Claim
46 words
The method of claim 12, wherein the dimetal alloy and silicon and the palladium are placed into a perpendicularly positioned melting tube, which is sealed at the bottom, and inductively melted with a high frequency field and the melting tube is rotated around the tubular axis.
Claim 15
Dependent Claim
29 words
The method of claim 15, wherein during the solidification of the melt, the melting tube is lowered from the high frequency field, in the direction of the tubular axis.
References Cited (Backward Citations)
GB193050A
Cited
US1647301A
Cited
US2900251A
Cited
US3070875A
Cited
US3220828A
Cited
US3297436A
Cited
US3470033A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-20 | 1975-03-22 | 1975-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-20 | 1979-03-22 | 1979-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-20 | 1983-03-22 | 1983-09-21 | $7700.00 | Window Closed / Lapsed |