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US3650778A
Expired / Lapsed
US
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Low-expansion, low-melting zinc phosphovanadate glass compositions
Assignee: Fairchild Semiconductor Corp
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Filing: 1969-10-29
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Granted: 1972-03-21
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Expires: 1989-10-29
Abstract
Abstract Low-melting, low-expansion, lead-free glass compositions are provided for sealing ceramics parts and encapsulating ceramic substrates. In addition to having a thermal expansion matching that of alumina, the glass compositions provide for the formation of a glass-to-alumina seal in the 380* to 450* C. temperature range.
Inventors
- 👤 Maurice E Dumesnil
- 👤 Robert R Hewitt
- 👤 Joseph L Bozarth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:25
CPC Classifications
C; C03; C03C; C03C8/00; C03C8/24; C03C3/00; C03C3/12; C03C3/16; C03C3/21
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-03-21 | 1975-09-20 | 1976-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-03-21 | 1979-09-20 | 1980-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-03-21 | 1983-09-20 | 1984-03-21 | $7700.00 | Window Closed / Lapsed |