Semiconductor flip-chip soldering method

Abstract

Abstract The present disclosure relates to a method of reliably soldering a semiconductor flip-chip to a semiconductor flip-chip package. A hot reducing gas is passed through a reducing gas guidance device onto surface oxidized solder which is upon the electrodes of the flip-chip, to melt the surface oxidized solder and to purify the surface oxidized solder. Simultaneously, the hot reducing gas is also passed through the reducing gas guidance device onto surface oxidized solder on bonding pads of the flip-chip package, to melt this surface oxidized solder and to purify this surface oxidized solder. Due to the purification of the surface oxidized solder of the electrodes and of the bonding pads, when the solder on the electrodes and of the bonding pads is brought together, the purified solder easily coalesces together. This method produces reliable electrical connections between a semiconductor flip-chip and a semiconductor flip-chip package.

Inventors

• 👤 John O Percival

Bibliographic Details