Patent US3698075A successfully refreshed from Google Patents.
US3698075A
Expired / Lapsed
US
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Ultrasonic metallic sheet-frame bonding
Assignee: Motorola Solutions Inc
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Filing: 1969-11-05
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Granted: 1972-10-17
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Expires: 1989-11-05
Abstract
Abstract In simultaneously bonding all the bonding pads of an integrated circuit chip to respective inwardly extending leads comprising parts of an unsupported metallic sheet-frame, a chip bearing the integrated circuit is positioned with its pads in contact with the ends or tips of the leads, comprising part of the frame, on a bonding post. The contacting flat tip of a bonding needle is pressed against the back of the chip to squeeze the ends of the leads and the pads together and the bonding needle is vibrated to cause rubbing motion between the tips of the leads and the bonding pads thereby to bond the ends of the leads to their respective pads. To make sure that the vibrating force is applied to the chip, the flat tip of the steel needle has a layer of soft metal such as copper deposited thereon. To make sure that the ends of the leads do not move and yet to prevent cutting through the leads, the top of the post is not serrated but is roughened as by vapor honing. The tips of the leads are thinned by the squeezing action. The honing also puts a slight curvature on the edges of the posts that are in contact with the leads, whereby a curvature is imparted to the leads at the junction of the thinned and unthinned portions thereof, whereby the leads are weakened at this junction to a lesser extent than in the prior art. The working tip of the post is made hollow to concentrate the compressive force to the area where the leads are in contact with the bonding pads, thereby requiring less pressure on the needle.
Inventors
- 👤 Donald Francis Boyle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 21:26
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/10; B29; B29C; B29C65/00; B29C65/02; B29C65/08; B29C66/00; B29C66/80; B29C66/81; B29C66/814; B29C66/8141; B29C66/81427; B29C66/81433; B29C66/83; B29C66/832; B29C66/8322; B65; B65D; B65D63/00; B65D63/10; B65D63/14; F; F16; F16L; F16L3/00; F16L3/22; F16L3/23; F16L3/233; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
325 words
The method of bonding substantially simultaneously a group of metal leads to a corresponding plurality of bonding pads on a semiconductor chip and utilizing an ultrasonically vibrating needle for said bonding, comprising providing a frame member which can be independently handled as a unit and which has a plurality of said groups of metal leads therewith, each such lead having a bonding portion at its inner end for bonded connection to a corresponding chip pad, positioning said frame member in bonding apparatus with a group of leads on a pedestal, which pedestal has a configuration at its surface and has a surface of such physical condition that the lead bonding portion of each lead in a group of leads is both supported on said pedestal surface and maintained in a fixed position thereon during an ultrasonic bonding operation, positioning a chip on said group of leads with the chip contact pads engaging corresponding lead bonding portions, and said chip having said ultrasonically vibrating needle in engagement with the face of said chip opposite to that face having the bonding pads thereon with the end face of said needle having a physical condition such that it moves the chip in a lateral direction therewith relative to the lead bonding portions during a bonding operation of the needle, applying pressure to maintain the chip contact pads and lead bonding portions in engagement and applying vibratory energy to said needle to move the latter in a lateral direction at ultrasonic speed, with said lead bonding portions remaining fixed on said pedestal and said chip remaining fixed relative to said needle but movable with said needle relative to said lead bonding portions to substantially simultaneously bond said pads and lead portions together, and moving said frame member independently after bonding a chip to each said group of leads to provide an assembly in said frame member for each said group whereby to permit subsequent use of each such assembly.
Claim 2
Independent Claim
325 words
The method of bonding substantially simultaneously a group of metal leads to a corresponding plurality of bonding pads on a semiconductor chip and utilizing an ultrasonically vibrating needle for said bonding, comprising providing a frame member which can be independently handled as a unit and which has a plurality of said groups of metal leads therewith, each such lead having a bonding portion at its inner end for bonded connection to a corresponding chip pad, positioning said frame member in bonding apparatus with a group of leads on a pedestal, which pedestal has a configuration at its surface and has a surface of such physical condition that the lead bonding portion of each lead in a group of leads is both supported on said pedestal surface and maintained in a fixed position thereon during an ultrasonic bonding operation, positioning a chip on said group of leads with the chip contact pads engaging corresponding lead bonding portions, and said chip having said ultrasonically vibrating needle in engagement with the face of said chip opposite to that face having the bonding pads thereon with the end face of said needle having a physical condition such that it moves the chip in a lateral direction therewith relative to the lead bonding portions during a bonding operation of the needle, applying pressure to maintain the chip contact pads and lead bonding portions in engagement and applying vibratory energy to said needle to move the latter in a lateral direction at ultrasonic speed, with said lead bonding portions remaining fixed on said pedestal and said chip remaining fixed relative to said needle but movable with said needle relative to said lead bonding portions to substantially simultaneously bond said pads and lead portions together, and moving said frame member independently after bonding a chip to each said group of leads to provide an assembly in said frame member for each said group whereby to permit subsequent use of each such assembly.
Claim 3
Dependent Claim
57 words
The method of bonding as defined in claim 1, wherein the face surface of the semiconduCtor chip engaged by the bonding needle is physically conditioned so as to cooperate with the end face of said needle in providing the gripping to move the chip laterally in a vibratory pattern as the needle moves in a bonding operation.
Claim 4
Dependent Claim
47 words
The method of bonding as defined in claim 1, wherein the metal of the leads for each group of leads in the frame member has a tensile strength of from 10,000 to 24,000 pounds per square inch and a thickness of from 1 1/2 to 4 mils.
Claim 5
Dependent Claim
24 words
The method of bonding as defined in claim 3 wherein the metal of the leads is one of the class comprising aluminum and copper.
Claim 6
Dependent Claim
41 words
The method of bonding as defined in claim 1 wherein the frame member is originally provided for the bonding operation in the form of a continuous strip wound on a spool to be removed from the spool as needed for bonding.
Claim 7
Dependent Claim
24 words
The method of bonding as defined in claim 1 wherein the pedestal has a vapor-honed surface upon which the lead bonding portions are supported.
Claim 8
Dependent Claim
29 words
The method of bonding as defined in claim 1 wherein the end face of the needle has a surface softer than the material of the shank of that needle.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-17 | 1976-04-17 | 1976-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-17 | 1980-04-17 | 1980-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-17 | 1984-04-17 | 1984-10-17 | $7700.00 | Window Closed / Lapsed |