US3710193A — Hybrid regulated power supply having individual h…

Claim 1

Independent Claim 112 words

An electronic circuit package having as elements thereof an electronic component generative of undesired heat and an electronic heat sensitive component thermally decouplable therefrom, comprising: a first chassis carrying the heat generative component and having high thermal conductivity for providing a thermal conductor to the package exterior; a second chassis carrying the heat sensitive electronic component and having high thermal conductivity to provide a thermal conductor to the package exterior, said second chassis being disposed so as to be essentially thermoconductively independent of the first chassis; and means joining the first and second chassis in mutually spaced relationship and being substantially non-conductive of heat generated by the components carried by the chassis.

Claim 2

Dependent Claim 112 words

An electronic circuit package having as elements thereof an electronic component generative of undesired heat and an electronic heat sensitive component thermally decouplable therefrom, comprising: a first chassis carrying the heat generative component and having high thermal conductivity for providing a thermal conductor to the package exterior; a second chassis carrying the heat sensitive electronic component and having high thermal conductivity to provide a thermal conductor to the package exterior, said second chassis being disposed so as to be essentially thermoconductively independent of the first chassis; and means joining the first and second chassis in mutually spaced relationship and being substantially non-conductive of heat generated by the components carried by the chassis.

Claim 3

Dependent Claim 93 words

An electronic circuit package having as elements thereof an electronic component generative of undesired heat and at least one electronic heat sensitive component thermally decouplable therefrom, comprising: a first chassis carrying the heat generative component and having high thermal conductivity for providing a thermal conductor to the package exterior; a second chassis carrying the heat sensitive electronic component, and having high thermal conductivity to provide a thermal conductor to the package exterior; and a thermally insulating tubular shell disposed between the first and second chassis to form an enclosure for the electronic components.

Claim 4

Dependent Claim 93 words

An electronic circuit package having as elements thereof an electronic component generative of undesired heat and at least one electronic heat sensitive component thermally decouplable therefrom, comprising: a first chassis carrying the heat generative component and having high thermal conductivity for providing a thermal conductor to the package exterior; a second chassis carrying the heat sensitive electronic component, and having high thermal conductivity to provide a thermal conductor to the package exterior; and a thermally insulating tubular shell disposed between the first and second chassis to form an enclosure for the electronic components.

Claim 5

Dependent Claim 24 words

The electronic circuit package claim 2, wherein: the first and second chassis each comprises a plate spaced in generally parallel relation from the other.

Claim 6

Dependent Claim 39 words

The electronic circuit package of claim 2, further comprising: a circuit substrate having mounted thereon the components comprising elements of an electrical circuit, the substrate being secured to one of the chassis to be in heat conductive contact therewith.

Claim 7

Dependent Claim 32 words

The electronic circuit package of claim 4, wherein: the substrate has disposed thereon at least one conductive connection point for an electrical conductor connected to one or more of the circuit components.

Claim 8

Dependent Claim 39 words

The electronic circuit package of claim 5, further comprising: electrical conductor means connected to the connection point of the substrate and extending through the shell to provide an external electrical terminal for the electrical circuit components on the substrate.

Claim 9

Dependent Claim 58 words

The electronic circuit package of claim 4, wherein: each of the chassis has associated therewith a substrate carrying conductive areas; the heat generative component is electrically connected to one or more conductive areas of one of such substrates; and the heat sensitive components are electrically connected to one or more conductive areas of the other of such substrates.

Claim 10

Dependent Claim 31 words

The electronic circuit package of claim 7, wherein: THE electronic circuit components comprise at least in part a film deposit on the substrate, such substrate being thermally conductive and electrically non-conducting.

Claim 11

Dependent Claim 32 words

The electronic circuit package of claim 4, wherein: the substrate is electrically non-conducting and thermally conductive, and the heat generative component is mounted thereto in heat transfer relation to the first chassis.

Claim 12

Dependent Claim 27 words

The electronic circuit package of claim 7, further comprising: electrical conductor means for terminating the conductive areas externally of the package portion comprised of the joining means.

Claim 13

Dependent Claim 63 words

The electronic circuit package of claim 2, further comprising: means associated with the first chassis and providing a heat spreading volume exposed to the interior of the tubular shell and thermally connected to the first chassis through a relatively low thermal resistance for dissipating to the package exterior a portion of the heat within the enclosure, said means mounting the heat generative component.

Claim 14

Dependent Claim 112 words

In an electrical circuit unit containing at least one electronic circuit component generative of undesired heat and further electronic components of the circuit that are heat-sensitive, an arrangement for increasing the power and temperature operating capacities of the circuit comprising: a first heat conductive member carrying the heat generative component and providing low thermal resistance between such component and the ambience, such member including an external heat transfer surface; a second member carrying the heat sensitive components and providing an external heat transfer surface, said second member being essentially completely thermoconductively decoupled from the first member; and means joining the first and second members and establishing therebetween a relatively high thermal resistance.

Claim 15

Dependent Claim 112 words

In an electrical circuit unit containing at least one electronic circuit component generative of undesired heat and further electronic components of the circuit that are heat-sensitive, an arrangement for increasing the power and temperature operating capacities of the circuit comprising: a first heat conductive member carrying the heat generative component and providing low thermal resistance between such component and the ambience, such member including an external heat transfer surface; a second member carrying the heat sensitive components and providing an external heat transfer surface, said second member being essentially completely thermoconductively decoupled from the first member; and means joining the first and second members and establishing therebetween a relatively high thermal resistance.

Claim 16

Dependent Claim 41 words

An electrical circuit unit according to claim 12, wherein: the heat generative component is a solid state active element having relatively high current capacity; and the heat sensitive components include a solid state device operating on relatively low current flow therethrough.

Claim 17

Dependent Claim 35 words

The electrical circuit unit of claim 13, wherein: the high current capacity element is a power transistor; and the low operating current device includes a signal level semiconductor for controlling the high current capacity element.

Claim 18

Dependent Claim 27 words

The electrical circuit unit of claim 13, wherein: the electrical circuit is a power supply regulator in which current is supplied by the high current capacity element.

Claim 19

Dependent Claim 34 words

The electrical circuit unit of claim 15, wherein: the low operating current device comprises a portion of a power supply regulator control circuit operative to control the conduction of the high current capacity element.

Claim 20

Dependent Claim 28 words

The electrical circuit unit of claim 16, wherein: the control circuit includes passive elements deposited as a film on a substrate carried by the second heat conductive member.

Claim 21

Dependent Claim 55 words

The electrical circuit of claim 16, wherein: the unit includes a heat conductive substrate secured to the second member; the second member is heat conductive to provide thermal coupling to the environment; and the low operating current device is an integrated circuit chip mounted on such substrate to be thermally coupled to the second member.

Claim 22

Dependent Claim 69 words

The electrical circuit of claim 16, wherein: the unit includes a heat conductive substrate carried by the first heat conductive member and providing an electrical conductor thereon; and a volume of material having relatively low thermal resistance is mounted to the substrate to be thermally coupled therewith to form a heat spreader adapted to distribute to the first member the heat originating at the active high current capacity element.

Claim 23

Dependent Claim 24 words

The electrical circuit of claim 19, further comprising: means for electrically connecting the active high current capacity element to the conductor on the substrate.

Claim 24

Dependent Claim 114 words

A compact electrical regulator unit adapted for physical mounting to other equipment which may provide a heat sink therefor, comprising: first and second spaced heat conductive members at least one of which has an exterior surface for mounting to an external heat sink to provide a path of a thermal conduction to the unit exterior; a shell of low thermal conduction intermediate and joining the two members to form therewith an enclosure; an active power output circuit carried by the interior surface of the first member and thermally coupled therewith; and a voltage regulator control circuit carried by the interior surface of the other member for regulating the conduction of the power output circuit.

Claim 25

Dependent Claim 114 words

A compact electrical regulator unit adapted for physical mounting to other equipment which may provide a heat sink therefor, comprising: first and second spaced heat conductive members at least one of which has an exterior surface for mounting to an external heat sink to provide a path of a thermal conduction to the unit exterior; a shell of low thermal conduction intermediate and joining the two members to form therewith an enclosure; an active power output circuit carried by the interior surface of the first member and thermally coupled therewith; and a voltage regulator control circuit carried by the interior surface of the other member for regulating the conduction of the power output circuit.

Claim 26

Dependent Claim 28 words

The power supply unit of claim 21, wherein: the active power output circuit comprises a semiconductor chip; and the voltage regulator control circuit comprises an integrated circuit chip.

Claim 27

Dependent Claim 40 words

The power supply unit of claim 21, wherein: the other heat conductive member provides an exterior surface for mounting to an external heat sink, whereby the unit may be thermally coupled to an external heat sink at either conductive member.

Claim 28

Dependent Claim 98 words

A hybrid power supply regulator, comprising: first and second heat conductive members each providing thermal coupling to an exterior surface thereof; a pass transistor chip mounted to the first member to be thermally coupled thereto through a relatively low thermal resistance; a control circuit including an integrated circuit chip, the circuit being secured to the second member to be thermally coupled thereto through a relatively low thermal resistance; and thermal insulating means joining the two members to establish therebetween a relatively high thermal resistance, thereby substantially to isolate the control circuit from heat dissipated by the pass transistor.

Claim 29

Dependent Claim 98 words

A hybrid power supply regulator, comprising: first and second heat conductive members each providing thermal coupling to an exterior surface thereof; a pass transistor chip mounted to the first member to be thermally coupled thereto through a relatively low thermal resistance; a control circuit including an integrated circuit chip, the circuit being secured to the second member to be thermally coupled thereto through a relatively low thermal resistance; and thermal insulating means joining the two members to establish therebetween a relatively high thermal resistance, thereby substantially to isolate the control circuit from heat dissipated by the pass transistor.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1976-01-09	1976-07-10	1977-01-09	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1980-01-09	1980-07-10	1981-01-09	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	1984-01-09	1984-07-10	1985-01-09	$7700.00	Window Closed / Lapsed

Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components

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