Patent US3733685A successfully refreshed from Google Patents.
US3733685A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a passivated wire bonded semiconductor device
Assignee: Motors Liquidation Co
•
Filing: 1971-05-03
•
Granted: 1973-05-22
•
Expires: 1991-05-03
Abstract
Abstract A semiconductive device is described in which electrical contact is made with the semiconductor surface through a rupture in an overlying frangible dielectric coating. Contact is achieved by forming an electrode pad on the semiconductor surface, coating the surface of the semiconductor and the electrode pad with a frangible layer of dielectric, forming a terminal connector contact pad on the dielectric coating over the electrode pad, rupturing the dielectric layer to communicate the pads, and bonding a terminal lead to the connector contact pad. In a preferred embodiment, the rupturing and bonding steps are simultaneously achieved by compression bonding a terminal wire to the connector contact pad.
Inventors
- 👤 J Kauppila
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/43; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07554; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/90; H10W72/921; H10W72/926; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
50 words
The process as defined in claim 1 wherein the dielectric coating is approximately 0.05 - 1.0 micron thick, the first and second contact pads are of the same metal, and the deforming and bonding steps are simultaneously performed by compression bonding a terminal lead wire to the second contact pad.
Claim 2
Dependent Claim
24 words
The process as defined in claim 2 wherein the compression bonding technique is selected from the class consisting of thermocompression bonding and ultrasonic bonding.
Claim 3
Dependent Claim
31 words
The method as defined in claim 1 wherein the dielectric coating is approximately 0.05 - 0.2 micron in thickness and the contact pads are about 0.2 - 0.5 micron in thickness.
Claim 4
Dependent Claim
87 words
The method as defined in claim 4 wherein the dielectric coating is of nonconductive, relatively inert, brittle material such as tantalum oxide, the contact pads are of a ductile metal such as aluminum, the terminal connector is a wire of a ductile metal such as selected from the class consisting of gold and aluminum, the terminal wire is of a thickness of less than about 3 mils, and the deforming and bonding steps are simultaneously performed by compression bonding the terminal wire to the first contact pad.
Claim 5
Dependent Claim
24 words
The process as defined in claim 5 wherein the compression bonding technique is selected from the group consisting of thermocompression bonding and ultrasonic bonding.
References Cited (Backward Citations)
US3028663A
Cited
US3087239A
Cited
US3235945A
Cited
US3330026A
Cited
US3397451A
Cited
US3444612A
Cited
US3610506A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-05-21 | 1976-11-20 | 1977-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-05-21 | 1980-11-20 | 1981-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-05-21 | 1984-11-20 | 1985-05-22 | $7700.00 | Window Closed / Lapsed |