Support for photosensitive resin

Claim 2

A support for a photosensitive resin for use in making a printing plate using liquid photosensitive resin, said support comprising a flexible self-supporting base plate and an adhesive layer formed thereon for applying a layer of the photosensitive resin, wherein said adhesive layer is a three-dimensional cured product containing 1 × 10 -4 to 1 × 10 -2 mol/gr. of effectively photopolymerizable unsaturated carbon-to-carbon double bonds, which have been formed from a composition consisting of (A), (B) and (C) as shown below: A. a compound which is a linear polycondensation product formed between epichlorohydrin and polyhydric phenolic compound, the polycondensation product having a molecular weight of up to 4,000 and containing 1,2-epoxy groups at both terminals, or a diepoxy ester compound selected from the group consisting of diglycidyl-2,6-naphthalenedicarboxylate, diglycidyl-2,7-naphthalenedicarboxylate, diglycidyl o-phthalate, diglycidyl isophthalate, diglycidyl terephthalate, diglycidyl methylisophthalate, and diglycidyl methylterephthalate; B. a compound selected from one of the group comprising i. a compound containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR5## wherein R is a hydrogen or an alkyl and a 1,2-epoxy group in the molecule and having a boiling point of at least 120° C., or ii. a reaction product of the component (B) (i) with an amine curing agent selected from the group consisting of aliphatic amines, aromatic amines and amino-terminated polyamide resin obtained by the condensation of an aliphatic dicarboxylic acid with ethylene diamine and having a degree of polymerization of 5 to 20, the reaction product containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR6## wherein R is hydrogen or an alkyl, and an amino group in the molecule and having a boiling point of at least 120° C.; and C. an organic curing agent for epoxy resins containing at least two active hydrogen atoms but not containing an effectively photopolymerizable carbon-to-carbon double bond, or an organic compound convertible to said curing agent during the reaction, and selected from the group consisting of: aliphatic amines, aromatic amines, polycarboxylic acids, acid anhydrides, phenol resins, urea resins, polyester resins, polysulfide resins, melamine resins, and polyamide resins.

Claim 3

The support of claim 1 wherein said component (A) is a linear polycondensation product formed between epichlorohydrin and a polyhydric phenolic compound.

Claim 4

The support of claim 1 wherein said component (B) (i) is a member selected from the group consisting of glycidyl acrylate, glycidyl methacrylate and an epoxyacrylate resin.

Claim 5

The support of claim 1 wherein said curing agent of component (C) is a polyamide resin.

Claim 6

The support of claim 1 wherein the proportion of said component (B) (i) or (B) (ii) is 0.5 to 5 times the weight of said component (A).

Claim 7

The support of claim 1 wherein said curing agent of component (C) is a poly carboxylic acid.

Claim 8

The support of claim 1 wherein said orgamic compound of component (C) is a poly-carboxylic acid anhydride.

Claim 9

The support of claim 1 wherein said adhesive layer contains from 1 × 10 -3 to 4 × 10 -3 mol per gram of the carbon-to-carbon double bond.

Claim 10

The support of claim 1 wherein component (B) (i) is present.

Claim 11

The support of claim 9 wherein the components are present in the proportions of A. -- 10 to 70% by weight B. (i) -- 10 to 88% by weight, and C. -- 2 to 80% by weight, the sum of the components being 100% by weight.

Claim 12

The support of claim 1 wherein component (B) (ii) is present.

Claim 13

The support of claim 11 wherein the components are present in the proportions of A. -- 10 to 70% by weight, B. (ii) -- 30 to 80% by weight, and C. -- 1 to 60% by weight, the sum of the components being 100% by weight.

Claim 14

A process for producing a support for photosensitive resin for use in making a printing plate using a liquid photosensitive resin, said process comprising the steps of applying, onto a flexible self-support base plate, and adhesive composition consisting of (A), (B) and (C) as shown below: A. a compound which is a linear polycondensation product formed between epichlorohydrin and polyhydric phenolic compound, the polycondensation product having a molecular weight of up to 4,000 and containing 1,2-epoxy groups at both terminals or a diepoxyester compound selected from the group consisting of diglycidyl-2,6-naphthalenedicarboxylate, diglycidyl-2,7-naphthalenedicarboxylate, diglycidyl o-phthalate, diglycidyl isophthalate, diglycidyl terephthalate, diglycidyl methylisophthalate, and diglycidyl methylterephthalate; B. a compound selected from one of the group comprising i. a compound containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR7## wherein R is hydrogen or an alkyl, and a 1,2-epoxy group in the molecule and having a boiling point of at least 120° C., or ii. a reaction product of the component (B) (i) with an amine curing agent selected from the group consisting of aliphatic amines, aromatic amines, and amino-terminated polyamide resin obtained by the condensation of an aliphatic dicarboxylic acid with ethylene diamine and having a degree of polymerization of 5 to 20, the reaction product containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR8## wherein R is hydrogen or an alkyl, and an amino group in the molecule and having a boiling point of at least 120° C.; and C. an organic curing agent for epoxy resins containing at least two active hydrogen atoms but not containing an effectively photopolymerizable carbon-to-carbon double bond, or an organic compound convertible to said curing agent during the reaction, and selected from the group consisting of: aliphatic amines, aromatic amines, polycarboxylic acids, acid anhydrides, phenol resins, urea resins, polyester resins, polysulfide resins, melamine resins, and polyamide resins; and then heating the adhesive composition to a temperature from 50° C. to 180° C. so as to thereby cure it three-dimensionally on the flexible self-supporting base plate in a fashion such that an adhesive layer containing 1 × 10 -4 to 1 × 10 -2 mol/gr. of an effectively photopolymerizable unsaturated carbon-to-carbon double bond is formed on the flexible self-supporting base plate.

Claim 15

A process for producing a support for photosensitive resin for use in making a printing plate using a liquid photosensitive resin, said process comprising the steps of applying, onto a flexible self-support base plate, and adhesive composition consisting of (A), (B) and (C) as shown below: A. a compound which is a linear polycondensation product formed between epichlorohydrin and polyhydric phenolic compound, the polycondensation product having a molecular weight of up to 4,000 and containing 1,2-epoxy groups at both terminals or a diepoxyester compound selected from the group consisting of diglycidyl-2,6-naphthalenedicarboxylate, diglycidyl-2,7-naphthalenedicarboxylate, diglycidyl o-phthalate, diglycidyl isophthalate, diglycidyl terephthalate, diglycidyl methylisophthalate, and diglycidyl methylterephthalate; B. a compound selected from one of the group comprising i. a compound containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR7## wherein R is hydrogen or an alkyl, and a 1,2-epoxy group in the molecule and having a boiling point of at least 120° C., or ii. a reaction product of the component (B) (i) with an amine curing agent selected from the group consisting of aliphatic amines, aromatic amines, and amino-terminated polyamide resin obtained by the condensation of an aliphatic dicarboxylic acid with ethylene diamine and having a degree of polymerization of 5 to 20, the reaction product containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR8## wherein R is hydrogen or an alkyl, and an amino group in the molecule and having a boiling point of at least 120° C.; and C. an organic curing agent for epoxy resins containing at least two active hydrogen atoms but not containing an effectively photopolymerizable carbon-to-carbon double bond, or an organic compound convertible to said curing agent during the reaction, and selected from the group consisting of: aliphatic amines, aromatic amines, polycarboxylic acids, acid anhydrides, phenol resins, urea resins, polyester resins, polysulfide resins, melamine resins, and polyamide resins; and then heating the adhesive composition to a temperature from 50° C. to 180° C. so as to thereby cure it three-dimensionally on the flexible self-supporting base plate in a fashion such that an adhesive layer containing 1 × 10 -4 to 1 × 10 -2 mol/gr. of an effectively photopolymerizable unsaturated carbon-to-carbon double bond is formed on the flexible self-supporting base plate.