Method for making a raw board for use in printed circuits

Claim 1

A method for preparing a raw board for use in printed circuits comprising the steps of: (A) depositing copper layer onto a film or sheet of synthesized resins; (B) subjecting said copper-deposited film or sheet to an electrochemical treatment at a temperature between 40° C. and 90° C. with a first electroplating bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea; and (C) subjecting thereafter the film or sheet to an electrochemical treatment with a second electroplating bath containing copper sulfate and sulfuric acid.

Claim 2

A method for preparing a raw board for use in printed circuits comprising the steps of: (A) depositing copper layer onto a film or sheet of synthesized resins; (B) subjecting said copper-deposited film or sheet to an electrochemical treatment at a temperature between 40° C. and 90° C. with a first electroplating bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea; and (C) subjecting thereafter the film or sheet to an electrochemical treatment with a second electroplating bath containing copper sulfate and sulfuric acid.

Claim 4

A method for making a fllexible laminate of plastic and copper for use in printed circuits, comprising: (a) subjecting a flexible plastic film to vapor deposition with copper so as to vapor-deposit a first layer of copper directly onto the surface of said film, (b) immersing said film and first copper layer into a first electroplating bath including a brightener as an additive, said bath being as a temperature of about 40° C. to 90° C., and plating a second layer onto said first copper layer; and (c) subjecting thereafter the film to an electrochemical treatment with a second electroplating bath containing copper sulfate and sulfuric acid.

Claim 5

A method for making a fllexible laminate of plastic and copper for use in printed circuits, comprising: (a) subjecting a flexible plastic film to vapor deposition with copper so as to vapor-deposit a first layer of copper directly onto the surface of said film, (b) immersing said film and first copper layer into a first electroplating bath including a brightener as an additive, said bath being as a temperature of about 40° C. to 90° C., and plating a second layer onto said first copper layer; and (c) subjecting thereafter the film to an electrochemical treatment with a second electroplating bath containing copper sulfate and sulfuric acid.

Claim 8

A method for making a raw board for use in printed circuits, comprising the steps of (a) subjecting a very long film of a flexible plastic which can be easily rolled in a roll form to vapor deposition with a metal so as to vapor-deposit the metal directly onto the surface of the flexible film, (b) continuously immersing the flexible film in an electrochemical bath including as an additive a brightener which has its brightening effect only at a temperature between about 15° C. to 30° C., said bath being kept at a temperature between about 40°-90° C. where said brightner has no brightening effect so that a metal is continuously electroplated on the surface of the metal previously vapor-deposited on the surface of the flexible film, and (c) subjecting thereafter the film to an electrochemical treatment with a second electrochemical bath containing copper sulfate and sulfuric acid.

Claim 9

A method for making a raw board for use in printed circuits, comprising the steps of (a) subjecting a very long film of a flexible plastic which can be easily rolled in a roll form to vapor deposition with a metal so as to vapor-deposit the metal directly onto the surface of the flexible film, (b) continuously immersing the flexible film in an electrochemical bath including as an additive a brightener which has its brightening effect only at a temperature between about 15° C. to 30° C., said bath being kept at a temperature between about 40°-90° C. where said brightner has no brightening effect so that a metal is continuously electroplated on the surface of the metal previously vapor-deposited on the surface of the flexible film, and (c) subjecting thereafter the film to an electrochemical treatment with a second electrochemical bath containing copper sulfate and sulfuric acid.

Claim 10

A method for preparing a raw board for use in printed circuits comprising the steps of: (a) continuously feeding a copper-deposited long film of snythesized resins as a cathode; (b) guiding the film along at least a pair of anodes; (c) subjecting thereby the film to an electrochemical treatment at 40°-90° C. with a first electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and glazing agent including thiourea; (d) guiding thereafter the film above said first electrolytic bath; (e) transferring the film along another pair of anodes; and (f) subjecting thereby said film to a second electrochemical treatment with a second electrolytic bath containing copper sulfate and sulfuric acid.

Claim 11

A method for preparing a raw board for use in printed circuits comprising the steps of: (a) continuously feeding a copper-deposited long film of snythesized resins as a cathode; (b) guiding the film along at least a pair of anodes; (c) subjecting thereby the film to an electrochemical treatment at 40°-90° C. with a first electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and glazing agent including thiourea; (d) guiding thereafter the film above said first electrolytic bath; (e) transferring the film along another pair of anodes; and (f) subjecting thereby said film to a second electrochemical treatment with a second electrolytic bath containing copper sulfate and sulfuric acid.