Addition cure coating with improved adhesion

Claim 1

A latent curable electronic junction coating composition stabilized against premature gelation comprising: a. an olefinorganopolysiloxane having units of the structural formula: R.sub.a R'.sub.b SiO.sub.(4-a-b)/2 b. an organohydrogenpolysiloxane having units of the structural formula: R.sub.a SiH.sub.b SiO.sub.(4-a-b)/2 wherein R is selected from the group consisting of a monovalent hydrocarbon radical, a halogenated monovalent hydrocarbon radical, a cyanoalkyl radical and mixtures thereof, R' is an olefinic hydrocarbon radical, wherein a has a value of from 0 to 3, inclusive, b has a value of from 0.0005 to 2.0, inclusive, and the sum of a and b is equal to from 0.8 to 3, inclusive, c. a sufficient amount of a pltinum catalyst to cause the co-reaction of (a) and (b); and d. a combination of inhibiting agents comprised of (i) an ethylenically unsaturated isocyanurate corresponding to the structural formula: ##STR4## wherein R" is the same or different and is selected from the group consisting of hydrogen, alkyl, aryl, aralkyl polynuclear aryl, heteroaryl, monofunctional lower-alkenyl and the non-interfering substituted derivatives thereof with the proviso that at least one R" is lower-alkyl and (ii) a dialkylacetylenedicarboxylate having the structural formula: ROOCC.tbd.CCOOR wherein R is as described above and wherein said combination of ethylenically unsaturated isocyanurate and said dialkylacetylenedicarboxylate is present in an amount sufficient to inhibit premature gelation but insufficient to prevent cure at elevated temperature.