Patent US4356374A successfully refreshed from Google Patents.
US4356374A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronics circuit device and method of making the same
Assignee: Panasonic Holdings Corp
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Filing: 1980-07-10
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Granted: 1982-10-26
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Expires: 2000-07-10
Abstract
Abstract Principal faces of semiconductor devices (19) are bonded by means of a bond layer (17) on one face (lower face) of a heat-resistive flexible synthetic resin film (8, 16), for example, polyimide film, the other face (upper face) of the heat-resistive flexible synthetic resin film (8, 16) has bonded wiring conductor films (22) of a specified wiring pattern, and specified parts of electrode metal layers (20) or specified regions (66, 67) on the principal face of the semiconductor devices (19) and specified parts of the wiring conductor films (22) on the resin film (8, 16) are connected by conductor films (22) formed extending between them through through-holes with sloped wall (18, 18a, 32) formed on the resin film (8, 16). Also, a thin reinforcing frame (24) of a metal film, formed on said one (lower) face of the resin film (8, 16) with a specified pattern, may be connected to the wiring conductor films (22) through other through-holes (181) with sloped wall.
Inventors
- 👤 Masaharu Noyori
- 👤 Hiroaki Fujimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 10:47
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W70/099; H10W70/60; H10W70/611; H10W70/614; H10W70/67; H10W70/688; H10W70/69; H10W70/695; H10W72/00; H10W72/071; H10W72/077; H10W72/60; H10W72/701; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5524; H10W72/851; H10W72/874; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/9413; H10W74/00; H10W74/10; H10W74/131; H10W74/142; H10W90/00; H10W90/10; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
189 words
A method of making an electronic circuit device comprising the steps of: forming an etching mask of a specified pattern on a first resin film of a composite resin film comprising said first resin film and a second resin film, said first resin film and said second resin film being subject to etching by different etchants respectively, selectively etching said first resin film with a first etchant by utilizing said etching mask thereby forming recesses or holes, bonding at least one semiconductor device on said second resin film at the part where said recesses or holes are formed on the opposite side of the composite resin film by utilizing said second resin film as a bonding film, etching said second resin film exposed from said recesses or holes by means of a plasma etchant which is different from the first etchant, thereby forming through-holes with a sloped wall with a round peripheral part, and forming a wiring conductor of a metal film of a specified pattern on said first resin film and continuously into said through-holes, thereby electrically connecting specified parts of said semiconductor device and said wiring conductor.
Claim 2
Independent Claim
189 words
A method of making an electronic circuit device comprising the steps of: forming an etching mask of a specified pattern on a first resin film of a composite resin film comprising said first resin film and a second resin film, said first resin film and said second resin film being subject to etching by different etchants respectively, selectively etching said first resin film with a first etchant by utilizing said etching mask thereby forming recesses or holes, bonding at least one semiconductor device on said second resin film at the part where said recesses or holes are formed on the opposite side of the composite resin film by utilizing said second resin film as a bonding film, etching said second resin film exposed from said recesses or holes by means of a plasma etchant which is different from the first etchant, thereby forming through-holes with a sloped wall with a round peripheral part, and forming a wiring conductor of a metal film of a specified pattern on said first resin film and continuously into said through-holes, thereby electrically connecting specified parts of said semiconductor device and said wiring conductor.
Claim 3
Independent Claim
207 words
A method of making an electronic circuit device comprising the steps of: forming an etching mask of a specified pattern on a first resin film of a composite resin film comprising said first resin film and a second resin film, said first resin film and said second resin film being subject to etching by different etchants respectively, said composite resin film being mechanically strong enough to support at least one semiconductor device when bonded thereto, selectively etching with a first etchant said first resin film by utilizing said etching mask thereby forming recesses or holes, bonding said at least one semiconductor device on said second resin film at the part where said recesses or holes are formed on the opposite side of the composite resin film by utilizing said second resin film as a bonding film, etching said second resin film exposed from said recesses or holes by means of a plasma etchant, which is different from the first etchant thereby forming through-holes with a sloped wall with round peripheral part, and forming a wiring conductor of a metal film of a specified pattern on said first resin film and continuously into said through-holes thereby electrically connecting specified parts of said semiconductor device and said wiring conductor.
Claim 4
Independent Claim
207 words
A method of making an electronic circuit device comprising the steps of: forming an etching mask of a specified pattern on a first resin film of a composite resin film comprising said first resin film and a second resin film, said first resin film and said second resin film being subject to etching by different etchants respectively, said composite resin film being mechanically strong enough to support at least one semiconductor device when bonded thereto, selectively etching with a first etchant said first resin film by utilizing said etching mask thereby forming recesses or holes, bonding said at least one semiconductor device on said second resin film at the part where said recesses or holes are formed on the opposite side of the composite resin film by utilizing said second resin film as a bonding film, etching said second resin film exposed from said recesses or holes by means of a plasma etchant, which is different from the first etchant thereby forming through-holes with a sloped wall with round peripheral part, and forming a wiring conductor of a metal film of a specified pattern on said first resin film and continuously into said through-holes thereby electrically connecting specified parts of said semiconductor device and said wiring conductor.
Claim 5
Dependent Claim
34 words
A method of making an electronic circuit device in accordance with claim 1 or 2, wherein said composite resin film is etched by plasma etching and utilizing said semiconductor device as an etching mask.
Claim 6
Dependent Claim
35 words
A method of making an electronic circuit device in accordance with claim 1 or 2 and further comprising the step of bonding said first resin film through said second resin film onto a reinforcing frame.
Claim 7
Dependent Claim
20 words
A method of making an electronic circuit device in accordance with claim 4 wherein said reinforcing frame is of metal.
Claim 8
Dependent Claim
30 words
A method of making an electronic circuit device in accordance with claim 1 or 2 further comprising the step of coating the rear side of said semiconductor device with resin.
Claim 9
Dependent Claim
43 words
A method of making an electronic circuit device in accordance with claim 1 or 2 further comprising the step of disposing another electronic device on a principal face of said first resin film opposite to the bonding face with said second resin film.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-10-25 | 1986-04-26 | 1986-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-10-25 | 1990-04-26 | 1990-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-10-25 | 1994-04-26 | 1994-10-26 | $7700.00 | Window Closed / Lapsed |