Patent US4373974A successfully refreshed from Google Patents.
US4373974A
Expired / Lapsed
US
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Solder composition
Assignee: McDonnell Douglas Corp
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Filing: 1981-04-02
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Granted: 1983-02-15
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Expires: 2001-04-02
Abstract
Abstract Novel solder composition or solder cream, particularly adapted for soldering components in electronic circuitry, comprising finely divided solder metals such as tin and lead, dispersed in a vehicle containing viscosity controlling agents, organic solvents, and a rosin or rosin derivative as a flux. By employing a narrow range of rosin-containing vehicle, that is between 13 and 14%, and between 86 and 87% of solder metal, by weight of the solder composition, and fine particle size solder metal of from 40 to 70 microns, the formation of solder balls is essentially eliminated, thus avoiding the necessity of removing such solder balls.
Inventors
- 👤 Felix Barajas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 19:21
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262; B23K35/36; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H10; H10W; H10W72/00; H10W72/20; H10W95/00; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0263; H05K2201/0266; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K3/341; H05K3/3431; H05K3/3442; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
90 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a rosin type flux, the particle size of said metal ranging from 40 to 70 microns, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 2
Dependent Claim
90 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a rosin type flux, the particle size of said metal ranging from 40 to 70 microns, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 3
Dependent Claim
19 words
The composition of claim 1, employing 13.5% of said liquid vehicle and 86.5% of said solder metal by weight.
Claim 4
Dependent Claim
17 words
The composition of claim 2, the particle size of said metal ranging from 40 to 60 microns.
Claim 5
Dependent Claim
32 words
The composition of claim 1, said metal being selected from the group consisting of gold, silver, tin, germanium, silicon, antimony, bismuth, lead, indium, gallium, zinc, copper, phosphorus, and alloys and mixtures thereof.
Claim 6
Dependent Claim
26 words
The composition of claim 1, said metal being alloys or mixtures of tin, lead and silver; tin and lead; tin and silver; and lead and silver.
Claim 7
Dependent Claim
19 words
The composition of claim 5, employing 13.5% of said liquid vehicle and 86.5% of said solder metal by weight.
Claim 8
Dependent Claim
16 words
The composition of claim 1, said thixotropic agent being hydrogenated caster oil or carboxy methyl cellulose.
Claim 9
Dependent Claim
20 words
The composition of claim 1, said organic solvent being 2-butoxy (ethyl) ethyl acetate, 2-butoxy ethyl acetate, ethylene glycol or beta-terpineol.
Claim 10
Dependent Claim
12 words
The composition of claim 1, said rosin type flux comprising abietic acid.
Claim 11
Dependent Claim
21 words
The composition of claim 1, wherein said vehicle consists of 0.5-10% of (a), 30-60% (b) and 20-65% of (c), by weight.
Claim 12
Dependent Claim
31 words
The composition of claim 1, said thixotropic agent (a) being hydrogenated castor oil, said organic solvent (b) being 2-butoxy (ethyl) ethyl acetate, and said rosin type flux (c) comprising abietic acid.
Claim 13
Dependent Claim
98 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) 0.5-10% hydrogenated castor oil, (b) 30-60% 2-butoxy (ethyl) ethyl acetate and (c) 20-65% of a rosin type flux comprising abietic acid, the particle size of said metal ranging from 40 to 70 microns, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 14
Dependent Claim
98 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) 0.5-10% hydrogenated castor oil, (b) 30-60% 2-butoxy (ethyl) ethyl acetate and (c) 20-65% of a rosin type flux comprising abietic acid, the particle size of said metal ranging from 40 to 70 microns, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 15
Dependent Claim
12 words
The composition of claim 12, said vehicle including 0.01-10% of isopropyl amine.
Claim 16
Dependent Claim
27 words
The composition of claim 13, said vehicle consisting of 59% abietic acid, 31% 2-butoxy (ethyl) ethyl acetate, 8% hydrogenated castor oil and 2% isopropyl amine by weight.
Claim 17
Dependent Claim
31 words
The composition of claim 14, said liquid vehicle being present in an amount of 13.5% and said solder metal being present in an amount of 86.5%, by weight of said composition.
Claim 18
Dependent Claim
17 words
The composition of claim 15, the particle size of said metal ranging from 40 to 60 microns.
Claim 19
Dependent Claim
26 words
The composition of claim 12, said metal being alloys or mixtures of tin, lead and silver; tin and lead; tin and silver; and lead and silver.
Claim 20
Dependent Claim
12 words
The composition of claim 16, said solder metal being a tin-lead-silver alloy.
Claim 21
Dependent Claim
19 words
The composition of claim 18, said solder metal being an alloy of 62% tin, 2% silver and 36% lead.
Claim 22
Dependent Claim
12 words
The composition of claim 16, said solder metal being a tin-lead alloy.
Claim 23
Dependent Claim
88 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, the particle size of said metal ranging from 40 to 70 microns, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 24
Dependent Claim
88 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, the particle size of said metal ranging from 40 to 70 microns, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 25
Dependent Claim
14 words
The composition of claim 21, the metal particles of said solder metal being round.
Claim 26
Dependent Claim
85 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, the metal particles of said solder metal being round, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 27
Dependent Claim
85 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, the metal particles of said solder metal being round, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 28
Dependent Claim
76 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 29
Dependent Claim
76 words
A solder composition especially adapted for soldering components in electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, said liquid vehicle being present in an amount of 13 to 14%, and said solder metal being present in an amount of 86 to 87%, by weight of said composition.
Claim 30
Dependent Claim
16 words
The composition as defined in claim 20, the metal particles of said solder metal being round.
References Cited (Backward Citations)
US3684533A
Cited
US3762965A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-02-14 | 1986-08-16 | 1987-02-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-02-14 | 1990-08-16 | 1991-02-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-02-14 | 1994-08-16 | 1995-02-15 | $7700.00 | Window Closed / Lapsed |