Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
116 words
The method of electroding a poly(vinylidene fluoride) (PVF 2 ) solid comprising the steps of: providing a PVF 2 solid containing crystallites, abrading the surface of the PVF 2 solid to provide an irregular surface, rinsing the surface of the PVF 2 solid to remove surface contaminants, plasma etching the surface of the PVF 2 solid by activated free radical and ionic species of oxygen to created temporary molecular scale surface irregularities while keeping the PVF 2 solid at a room temperature below the melting point of its crystallites for dimensional stability, and sputtering a metallic layer upon the plasma etched surface of the PVF 2 solid before the temperary molecular scale surface irregularities have deteriorated.
Claim 2
Independent Claim
116 words
The method of electroding a poly(vinylidene fluoride) (PVF 2 ) solid comprising the steps of: providing a PVF 2 solid containing crystallites, abrading the surface of the PVF 2 solid to provide an irregular surface, rinsing the surface of the PVF 2 solid to remove surface contaminants, plasma etching the surface of the PVF 2 solid by activated free radical and ionic species of oxygen to created temporary molecular scale surface irregularities while keeping the PVF 2 solid at a room temperature below the melting point of its crystallites for dimensional stability, and sputtering a metallic layer upon the plasma etched surface of the PVF 2 solid before the temperary molecular scale surface irregularities have deteriorated.
Claim 3
Dependent Claim
36 words
The method of claim 1 wherein: said PVF 2 solid contains polarized, oriented crystallites, and wherein: the temperature of the PVF 2 solid, during plasma etching, is kept below that for reversion to the unpolarized state.
Claim 4
Dependent Claim
25 words
The method of claim 2 wherein the temperature of the PVF 2 solid, during sputtering, is kept below that for reversion to the unpolarized state.
Claim 5
Dependent Claim
38 words
The method as set forth in claim 1 having the added step of sputter etching the surface of the PVF 2 solid for further removal of surface contaminants, after plasma etching and prior to sputtering said metallic layer.
Claim 6
Dependent Claim
26 words
The method of claim 4 wherein: the temperature of the PVF 2 solid, during sputter etching is kept below that for reversion to the unpolarized state.
Claim 7
Dependent Claim
32 words
The method of claim 4 wherein: said sputtered metallic layer includes a chromium layer applied to said plasma etched surface of the PVF 2 solid, said chromium being selected for optimum adhesion.
Claim 8
Dependent Claim
27 words
The method of claim 6 wherein: said sputtered metallic layer also includes a layer of copper sputtered upon said chromium layer to a thickness suitable for electrodeposition.
Claim 9
Dependent Claim
29 words
The method set forth in claim 7 having the added step of electrodepositing copper upon said sputtered copper layer to a thickness suitable for electroding said PVF 2 solid.