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US4483389A Expired / Lapsed US ⏱️ 0.0 years remaining

Telescoping thermal conduction element for semiconductor devices

Assignee: International Business Machines Corp
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Filing: 1982-03-10
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Granted: 1984-11-20
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Expires: 2002-03-10
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Abstract

Abstract A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

Inventors

  • 👤 Demetrios Balderes
  • 👤 Joseph L. Horvath
  • 👤 Lewis D. Lipschutz

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 17:12
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 127 words
A compliant telescoping heat exchange element for conducting heat in a semiconductor package from a semiconductor device to a spaced heat sink comprising a first cup-shaped member formed of heat conductive metal provided with a flat bottom surface adapted to be placed in contact with a surface of said semiconductor device, and an annular wall, a second cup-shaped member formed of heat conductive metal provided with a flat bottom surface adapted to be placed in contact with a surface of said heat sink, and an annular resilient slotted wall juxtaposed in telescoping slidable relation to said wall of said first cup-shaped member, means to provide a firm sliding contact between said wall of said first cup-shaped member and the resilient slotted wall of said second cup-shaped member.
Claim 2
Dependent Claim 127 words
A compliant telescoping heat exchange element for conducting heat in a semiconductor package from a semiconductor device to a spaced heat sink comprising a first cup-shaped member formed of heat conductive metal provided with a flat bottom surface adapted to be placed in contact with a surface of said semiconductor device, and an annular wall, a second cup-shaped member formed of heat conductive metal provided with a flat bottom surface adapted to be placed in contact with a surface of said heat sink, and an annular resilient slotted wall juxtaposed in telescoping slidable relation to said wall of said first cup-shaped member, means to provide a firm sliding contact between said wall of said first cup-shaped member and the resilient slotted wall of said second cup-shaped member.
Claim 3
Dependent Claim 45 words
The heat exchange element of claim 1 wherein said means to provide firm sliding contact is comprised of an outward flaring of said wall of said second cup-shaped member, said outwardly flared wall maintained under stress by the said wall of said first cup-shaped member.
Claim 4
Dependent Claim 39 words
The heat exchange element of claim 2 wherein said wall of said first cup-shaped member is substantially perpendicular to said bottom surface, whereby an area contact is obtained between said walls of said first and said second cup-shaped members.
Claim 5
Dependent Claim 19 words
The heat exchange element of claim 3 wherein said bottom surfaces of said cup-shaped members are rectangular or square.
Claim 6
Dependent Claim 17 words
The heat exchange element of claim 3 wherein said bottom surfaces of said cup-shaped members are circular.
Claim 7
Dependent Claim 28 words
The heat exchange element of claim 3 wherein said heat conductive metal of said cup-shaped members is selected from a metal consisting of copper, silver and alloys thereof.
Claim 8
Dependent Claim 89 words
The heat exchange element of claim 1 wherein said means to provide firm sliding contact between said walls of said first cup-shaped member and the wall of said second cup-shaped member is comprised of an outwardly flared arcuate end portion on said wall of said second cup-shaped member, an inwardly directed arcuate end portion on said wall of said first cup-shaped member, said flared arcuate end portion and said inwardly directed arcuate surface maintaining sliding contact and also providing a force to bias said cup-shaped members in extended relation.
Claim 9
Dependent Claim 17 words
The heat exchange element of claim 7 wherein said wall of said first cup-shaped member is slotted.
Claim 10
Dependent Claim 24 words
The heat exchange element of claim 8 wherein said bottom surfaces of said first and said second cup shaped members are square or rectangular.
Claim 11
Dependent Claim 21 words
The heat exchange element of claim 1 which further includes a spring means to bias said cup-shaped members in extensible relation.
Claim 12
Dependent Claim 26 words
The heat exchange element of claim 10 which further includes interlocking corner tabs on said walls of said cup-shaped members that prevents separation of said members.
Claim 13
Dependent Claim 57 words
The heat exchange element of claim 1 wherein the annular wall of said first cup-shaped member and the annular wall of said second cup-shaped member are straight, and the inside dimensions of said first cup-shaped member correspond to the outside dimensions of said second cup-shaped member, said members when in telescoping relationship have an area wall contact.

References Cited (Backward Citations)

CA703015A Cited
US2905742A Cited
US2973400A Cited
US3106601A Cited
US3249680A Cited
US4295152A Cited
US4246597A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-11-20 1988-05-21 1988-11-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-11-20 1992-05-21 1992-11-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-11-20 1996-05-21 1996-11-20 $7700.00 Window Closed / Lapsed

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