Lead frame for molded integrated circuit package

Claim 1

A method of making a semiconductor device package that includes molding a plastic body member over a semiconductor die affixed to inner free ends of a convergent pattern of finger leads of a sheet-like lead frame, the lead frame having integral dam bars transversely connecting finger leads, the improvement of providing a lead frame in which each dam bar has a cut made before the molding operation between each end and a contiguous finger lead extending from an inner facing edge of the dam bar toward but not reaching the opposite dam bar edge, positioning the lead frame in a mold having a package body molding cavity periphery adjacent the dam bar inner facing edge to minimize flash between finger leads during molding, clamping the dam bars between opposed faces on the mold, molding a package body within the cavity without producing a significant web between finger leads, and cutting the balance of each dam bar from each finger lead without encountering excessive cutting die wear due to contact with abrasive body molding material.

Claim 2

A method of making a semiconductor device package that includes molding a plastic body member over a semiconductor die affixed to inner free ends of a convergent pattern of finger leads of a sheet-like lead frame, the lead frame having integral dam bars transversely connecting finger leads, the improvement of providing a lead frame in which each dam bar has a cut made before the molding operation between each end and a contiguous finger lead extending from an inner facing edge of the dam bar toward but not reaching the opposite dam bar edge, positioning the lead frame in a mold having a package body molding cavity periphery adjacent the dam bar inner facing edge to minimize flash between finger leads during molding, clamping the dam bars between opposed faces on the mold, molding a package body within the cavity without producing a significant web between finger leads, and cutting the balance of each dam bar from each finger lead without encountering excessive cutting die wear due to contact with abrasive body molding material.

Claim 3

A method of making a semiconductor device package that includes molding a plastic body member around a semiconductor die and its connected inner free ends of a convergent finger lead pattern on a sheet-like lead frame, the lead frame having integral dam bars transversely connecting finger leads, the improvement of providing a lead frame in which each dam bar is partially severed before the molding operation from each of its contiguous finger leads starting from a mold cavity-facing edge on the dam bar for a distance at least about one-third the dam bar inner and opposite edge spacing, the dam bar inner edge is not more than about one-half the aforementioned dam bar edge spacing and is located to be substantially congruent with a mold cavity for molding the plastic body member, positioning the lead frame in a mold with the dam bar inner edges located substantially at the periphery of a body cavity, clamping lead frame dam bars between opposed faces of the mold, injecting a plastic molding composition into the body cavity effective to mold the body member without concurrently producing any significant plastic fin between the finger leads, and cutting the dam bars completely away from the finger leads without depositing fin molding composition into the cutting die assembly and causing excessive cutting die wear, effective to produce an as-molded body on the package that can be used without any special surface finishing selective to body surface areas between the finger leads.

Claim 4

A method of making a semiconductor device package that includes molding a plastic body member around a semiconductor die and its connected inner free ends of a convergent finger lead pattern on a sheet-like lead frame, the lead frame having integral dam bars transversely connecting finger leads, the improvement of providing a lead frame in which each dam bar is partially severed before the molding operation from each of its contiguous finger leads starting from a mold cavity-facing edge on the dam bar for a distance at least about one-third the dam bar inner and opposite edge spacing, the dam bar inner edge is not more than about one-half the aforementioned dam bar edge spacing and is located to be substantially congruent with a mold cavity for molding the plastic body member, positioning the lead frame in a mold with the dam bar inner edges located substantially at the periphery of a body cavity, clamping lead frame dam bars between opposed faces of the mold, injecting a plastic molding composition into the body cavity effective to mold the body member without concurrently producing any significant plastic fin between the finger leads, and cutting the dam bars completely away from the finger leads without depositing fin molding composition into the cutting die assembly and causing excessive cutting die wear, effective to produce an as-molded body on the package that can be used without any special surface finishing selective to body surface areas between the finger leads.