US4493142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
III-V Based semiconductor devices and a process for fabrication
Assignee: Nokia Bell Labs
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Filing: 1982-05-07
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Granted: 1985-01-15
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Expires: 2002-05-07
Abstract
Abstract Extremely high-purity and defect-free layers of III-V semiconductor materials are produced by a specific MBE process. This process as applied to GaAs includes protecting the deposition substrate with a passivating surface, removing this surface in situ, treating the bared substrate heated to a temperature below its incongruent melting point with an arsenic-containing gas, and initiating the MBE growth in an environment containing an excess of arsenic over gallium.
Inventors
- 👤 James C. Hwang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 01:48
CPC Classifications
C; C30; C30B; C30B23/00; C30B23/02; C30B29/00; C30B29/10; C30B29/40; Y; Y10; Y10S; Y10S438/00; Y10S438/974; Y10S438/976
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
191 words
A process for producing a device, said device based on a III-V based semiconductor material comprising the steps of depositing said III-V based semiconductor material on a substrate characterized in that (1) a passivating layer is formed on said substrate before said deposition, (2) said passivating layer is removed in the presence of a flux of a volatile group V entity that repairs the surface of said substrate, wherein sufficient repair is essentially completed before said deposition is initiated to yield a surface exhibiting a reflection electron diffraction pattern having essentially continuous streaks, (3) said repair of said substrate is accomplished at a repair temperature above the passivating layer removal temperature and below the incongruent melting temperature of said semiconductor material wherein said flux is adequate to produce a repair of said surface which is sufficient to yield a stripped electron diffraction pattern, and (4) performing said deposition by treating said substrate with a flow containing an entity corresponding to each atom composing said semiconductor material, wherein the total flux of the volatile entities in said flow is in excess to the total flux of the nonvolatile entities in said flow.
Claim 2
Dependent Claim
191 words
A process for producing a device, said device based on a III-V based semiconductor material comprising the steps of depositing said III-V based semiconductor material on a substrate characterized in that (1) a passivating layer is formed on said substrate before said deposition, (2) said passivating layer is removed in the presence of a flux of a volatile group V entity that repairs the surface of said substrate, wherein sufficient repair is essentially completed before said deposition is initiated to yield a surface exhibiting a reflection electron diffraction pattern having essentially continuous streaks, (3) said repair of said substrate is accomplished at a repair temperature above the passivating layer removal temperature and below the incongruent melting temperature of said semiconductor material wherein said flux is adequate to produce a repair of said surface which is sufficient to yield a stripped electron diffraction pattern, and (4) performing said deposition by treating said substrate with a flow containing an entity corresponding to each atom composing said semiconductor material, wherein the total flux of the volatile entities in said flow is in excess to the total flux of the nonvolatile entities in said flow.
Claim 3
Dependent Claim
11 words
The process of claim 1 wherein said semiconductor material is GaAs.
Claim 4
Dependent Claim
15 words
The process of either claim 1 or claim 2 wherein said flow contains a dopant.
Claim 5
Dependent Claim
10 words
The process of claim 3 wherein said dopant comprises silicon.
Claim 6
Dependent Claim
13 words
The process of claim 1 wherein said semiconductor material comprises gallium aluminum arsenide.
Claim 7
Dependent Claim
11 words
The process of claim 1 wherein said substrate comprises gallium arsenide.
Claim 8
Dependent Claim
18 words
The process of claim 6 wherein said repair temperature is in the range 530 to 630 degrees C.
Claim 9
Dependent Claim
13 words
The process of claim 1 wherein said passivating layer is an oxide layer.
Claim 10
Dependent Claim
12 words
The process of claim 8 wherein said oxide undergoes said removal thermally.
Claim 11
Dependent Claim
16 words
The process of claim 8 wherein said oxide is formed by subjecting said substrate to water.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-01-15 | 1988-07-16 | 1989-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-01-15 | 1992-07-16 | 1993-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-01-15 | 1996-07-16 | 1997-01-15 | $7700.00 | Window Closed / Lapsed |