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US4493142A Expired / Lapsed US ⏱️ 0.0 years remaining

III-V Based semiconductor devices and a process for fabrication

Assignee: Nokia Bell Labs
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Filing: 1982-05-07
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Granted: 1985-01-15
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Expires: 2002-05-07
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Abstract

Abstract Extremely high-purity and defect-free layers of III-V semiconductor materials are produced by a specific MBE process. This process as applied to GaAs includes protecting the deposition substrate with a passivating surface, removing this surface in situ, treating the bared substrate heated to a temperature below its incongruent melting point with an arsenic-containing gas, and initiating the MBE growth in an environment containing an excess of arsenic over gallium.

Inventors

  • 👤 James C. Hwang

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 13:57
CPC Classifications
C; C30; C30B; C30B23/00; C30B23/02; C30B29/00; C30B29/10; C30B29/40; Y; Y10; Y10S; Y10S438/00; Y10S438/974; Y10S438/976

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 191 words
A process for producing a device, said device based on a III-V based semiconductor material comprising the steps of depositing said III-V based semiconductor material on a substrate characterized in that (1) a passivating layer is formed on said substrate before said deposition, (2) said passivating layer is removed in the presence of a flux of a volatile group V entity that repairs the surface of said substrate, wherein sufficient repair is essentially completed before said deposition is initiated to yield a surface exhibiting a reflection electron diffraction pattern having essentially continuous streaks, (3) said repair of said substrate is accomplished at a repair temperature above the passivating layer removal temperature and below the incongruent melting temperature of said semiconductor material wherein said flux is adequate to produce a repair of said surface which is sufficient to yield a stripped electron diffraction pattern, and (4) performing said deposition by treating said substrate with a flow containing an entity corresponding to each atom composing said semiconductor material, wherein the total flux of the volatile entities in said flow is in excess to the total flux of the nonvolatile entities in said flow.
Claim 2
Dependent Claim 191 words
A process for producing a device, said device based on a III-V based semiconductor material comprising the steps of depositing said III-V based semiconductor material on a substrate characterized in that (1) a passivating layer is formed on said substrate before said deposition, (2) said passivating layer is removed in the presence of a flux of a volatile group V entity that repairs the surface of said substrate, wherein sufficient repair is essentially completed before said deposition is initiated to yield a surface exhibiting a reflection electron diffraction pattern having essentially continuous streaks, (3) said repair of said substrate is accomplished at a repair temperature above the passivating layer removal temperature and below the incongruent melting temperature of said semiconductor material wherein said flux is adequate to produce a repair of said surface which is sufficient to yield a stripped electron diffraction pattern, and (4) performing said deposition by treating said substrate with a flow containing an entity corresponding to each atom composing said semiconductor material, wherein the total flux of the volatile entities in said flow is in excess to the total flux of the nonvolatile entities in said flow.
Claim 3
Dependent Claim 11 words
The process of claim 1 wherein said semiconductor material is GaAs.
Claim 4
Dependent Claim 15 words
The process of either claim 1 or claim 2 wherein said flow contains a dopant.
Claim 5
Dependent Claim 10 words
The process of claim 3 wherein said dopant comprises silicon.
Claim 6
Dependent Claim 13 words
The process of claim 1 wherein said semiconductor material comprises gallium aluminum arsenide.
Claim 7
Dependent Claim 11 words
The process of claim 1 wherein said substrate comprises gallium arsenide.
Claim 8
Dependent Claim 18 words
The process of claim 6 wherein said repair temperature is in the range 530 to 630 degrees C.
Claim 9
Dependent Claim 13 words
The process of claim 1 wherein said passivating layer is an oxide layer.
Claim 10
Dependent Claim 12 words
The process of claim 8 wherein said oxide undergoes said removal thermally.
Claim 11
Dependent Claim 16 words
The process of claim 8 wherein said oxide is formed by subjecting said substrate to water.

References Cited (Backward Citations)

US3493811A Cited
US3752713A Cited
US3969164A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-01-15 1988-07-16 1989-01-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-01-15 1992-07-16 1993-01-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-01-15 1996-07-16 1997-01-15 $7700.00 Window Closed / Lapsed

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