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US4496448A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for fabricating devices with DC bias-controlled reactive ion etching

Assignee: Nokia Bell Labs
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Filing: 1983-10-13
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Granted: 1985-01-29
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Expires: 2003-10-13
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Abstract

Abstract A method and apparatus for fabricating a device is disclosed, which method involves a new reactive ion etching technique. Both a high etch rate and, for example, a high etch selectivity are simultaneously achieved with the inventive reactive ion etching technique by discharging an electrode of the reactive ion etching apparatus in response to a preselected criterion, e.g., a magnitude of a DC bias at said electrode which equals, or exceeds, a preselected value.

Inventors

  • 👤 King L. Tai
  • 👤 Frederick Vratny

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 15:28
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32082; H01J37/32174; H01J37/32917; H01J37/3299; H01J2237/00; H01J2237/32; H01J2237/33; H01J2237/334; H01J2237/3341; H01J2237/3343; H01J2237/3345

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 64 words
A method for fabricating a device, comprising the steps of: establishing a plasma in a gaseous atmosphere which contacts a first electrode; establishing a DC bias on said electrode relative to a point of reference potential; and etching a substrate with entities in said plasma characterized in that: said method further comprises the step of discharging said electrode in response to a preselected criterion.
Claim 2
Independent Claim 64 words
A method for fabricating a device, comprising the steps of: establishing a plasma in a gaseous atmosphere which contacts a first electrode; establishing a DC bias on said electrode relative to a point of reference potential; and etching a substrate with entities in said plasma characterized in that: said method further comprises the step of discharging said electrode in response to a preselected criterion.
Claim 3
Dependent Claim 23 words
The method of claim 1 wherein said discharging occurs in response to a DC bias whose magnitude equals, or exceeds, a preselected value.
Claim 4
Dependent Claim 19 words
The method of claim 1 wherein said discharging occurs in response to a deviation from a preselected etch profile.
Claim 5
Dependent Claim 14 words
The method of claim 1 wherein said substrate is mounted on said first electrode.
Claim 6
Dependent Claim 31 words
The method of claim 1 wherein said substrate is mounted on a second electrode, said second electrode being spaced from said first electrode and connected to a point of reference potential.
Claim 7
Dependent Claim 24 words
The method of claim 1 wherein said discharging occurs automatically in response to a DC bias whose magnitude equals, or exceeds, a preselected value.
Claim 8
Dependent Claim 19 words
The method of claim 1 wherein said plasma is produced by capacitively coupling AC power into said gaseous atmosphere.
Claim 9
Dependent Claim 19 words
The method of claim 1 wherein said plasma is produced by inductively coupling AC power into said gaseous atmosphere.
Claim 10
Dependent Claim 14 words
The method of claim 1 wherein said plasma is produced by a DC discharge.
Claim 11
Dependent Claim 21 words
The method of claim 7 wherein a frequency of said AD power ranges from about 0.01 MHz to about 500 MHz.
Claim 12
Dependent Claim 21 words
The method of claim 8 wherein a frequency of said AC power ranges from about 0.01 MHz to about 500 MHz.
Claim 13
Dependent Claim 25 words
The method of claim 1 wherein said discharging occurs over a period of time less than about one-tenth the total etch time of said substrate.
Claim 14
Dependent Claim 25 words
The method of claim 1 wherein said discharging occurs over a period of time less than about one-hundredth the total etch time of said substrate.

References Cited (Backward Citations)

US3816198A Cited
US3708418A Cited
US3730873A Cited
US3664942A Cited
US4312732A Cited
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US4362611A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-01-29 1988-07-30 1989-01-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-01-29 1992-07-30 1993-01-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-01-29 1996-07-30 1997-01-29 $7700.00 Window Closed / Lapsed

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