Patent US950785A successfully refreshed from Google Patents.
Patent US4532401A successfully refreshed from Google Patents.
US4532401A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for cutting a wiring pattern
Assignee: Toshiba Corp
•
Filing: 1983-03-30
•
Granted: 1985-07-30
•
Expires: 2003-03-30
Abstract
Abstract An apparatus for cutting a faulty spot or area of a predetermined wiring pattern by radiating a laser beam and which includes a reset table in which a wafer chip is fixed in place on a support table. A radiating device is disposed above the rest table to permit the laser beam to be directed at the wiring pattern. A positioning device is connected to the radiating device to position the laser beam. Between the radiating device and the support table a cover is disposed to define a hermetically-sealed space including the wafer chip. A hole of the cover is coupled to a vacuum pump. After the space is placed in a vacuum the laser beam is radiated toward the wiring pattern to permit the portion of the wiring pattern to be cut.
Inventors
- 👤 Masakazu Shiozaki
- 👤 Hidetaro Nishimura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:56
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/12; B23K26/123; B23K26/1224; B23K26/36; B23K26/361
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
101 words
An apparatus for cutting a wiring pattern by radiating a laser beam, comprising: placing means for placing a substrate on which said wiring pattern is formed; fixing means for fixing said substrate in place, said fixing means including an insulating material that permits said substrate to be attached to said placing means by an electrostatic attraction; vacuum means for defining a space including said wiring pattern and for keeping said space at a vacuum level less than atmospheric pressure; and laser beam radiating means for radiating a laser beam toward said wiring pattern to cut a portion of said wiring pattern.
Claim 2
Independent Claim
101 words
An apparatus for cutting a wiring pattern by radiating a laser beam, comprising: placing means for placing a substrate on which said wiring pattern is formed; fixing means for fixing said substrate in place, said fixing means including an insulating material that permits said substrate to be attached to said placing means by an electrostatic attraction; vacuum means for defining a space including said wiring pattern and for keeping said space at a vacuum level less than atmospheric pressure; and laser beam radiating means for radiating a laser beam toward said wiring pattern to cut a portion of said wiring pattern.
Claim 3
Dependent Claim
14 words
An apparatus according to claim 1, wherein said insulating material is a Mylar sheet.
Claim 4
Dependent Claim
18 words
An apparatus according to claim 1, wherein said vacuum means includes a cover member mountable through sealing means.
Claim 5
Dependent Claim
30 words
An apparatus according to claim 3, wherein said cover member is made of a light transmitting material and is disposed between said laser beam radiating means and said placing means.
Claim 6
Dependent Claim
14 words
An apparatus according to claim 4, wherein said light transmitting material is quartz glass.
Claim 7
Dependent Claim
23 words
An apparatus according to claim 3, wherein said sealing means includes an O-ring hermetically mounted between said placing means and said cover member.
Claim 8
Dependent Claim
41 words
An apparatus according to claim 1, in which said vacuum means includes a vacuum pump adapted to be driven to cause a space including the wiring pattern to be kept under a vacuum level of 10 -1 to 10 -2 Torr.
Claim 9
Independent Claim
75 words
A method for cutting a wiring pattern by radiating a laser beam, comprising the steps of: placing on placing means a substrate on which said wiring pattern is formed; fixing said substrate in place on said placing means by an electrostatic attraction; causing a space including said wiring pattern to be kept under a vacuum level less than atmospheric pressure; and directing said laser beam onto a portion of the wiring pattern to be cut.
Claim 10
Independent Claim
75 words
A method for cutting a wiring pattern by radiating a laser beam, comprising the steps of: placing on placing means a substrate on which said wiring pattern is formed; fixing said substrate in place on said placing means by an electrostatic attraction; causing a space including said wiring pattern to be kept under a vacuum level less than atmospheric pressure; and directing said laser beam onto a portion of the wiring pattern to be cut.
Claim 11
Dependent Claim
22 words
A method according to claim 8, wherein said causing step includes sealing said space including said wiring pattern by a cover member.
Claim 12
Dependent Claim
23 words
A method according to claim 9, wherein said causing step includes hermetically coupling said placing means to said cover member by an O-ring.
Claim 13
Dependent Claim
26 words
A method according to claim 8, wherein said causing step includes keeping said space including said wiring pattern at a vacuum level by a vacuum pump.
Claim 14
Dependent Claim
29 words
A method according to claim 11, wherein said causing step includes keeping said space including said wiring pattern at a vacuum level of 10 -1 to 10 -2 Torr.
Claim 15
Independent Claim
111 words
An apparatus for cutting a wiring pattern by radiating a laser beam, comprising: placing means for placing a substrate on which said wiring pattern is formed; vacuum means for defining a space including said wiring pattern and for keeping said space at a vacuum level less than atmospheric pressure; laser beam radiating means for radiating a laser beam toward said wiring pattern to cut a portion of said wiring pattern; and positioning means for detecting the position of said substrate placed on said placing means and for moving said laser beam radiating means to permit said laser beam to be directed onto said portion of said wiring pattern to be cut.
Claim 16
Independent Claim
111 words
An apparatus for cutting a wiring pattern by radiating a laser beam, comprising: placing means for placing a substrate on which said wiring pattern is formed; vacuum means for defining a space including said wiring pattern and for keeping said space at a vacuum level less than atmospheric pressure; laser beam radiating means for radiating a laser beam toward said wiring pattern to cut a portion of said wiring pattern; and positioning means for detecting the position of said substrate placed on said placing means and for moving said laser beam radiating means to permit said laser beam to be directed onto said portion of said wiring pattern to be cut.
Claim 17
Independent Claim
105 words
A method for cutting a wiring pattern using means for radiating a laser beam, comprising the steps of: placing on placing means a substrate on which said wiring pattern is formed; causing a space including said wiring pattern to be kept under a vacuum level less than atmospheric pressure; directing said laser beam onto a portion of said wiring pattern to be cut; and detecting, before said laser beam directing step, the position of said substrate on said placing means and moving said laser beam radiating means to permit said laser beam to be directed onto said portion of the wiring pattern to be cut.
Claim 18
Independent Claim
105 words
A method for cutting a wiring pattern using means for radiating a laser beam, comprising the steps of: placing on placing means a substrate on which said wiring pattern is formed; causing a space including said wiring pattern to be kept under a vacuum level less than atmospheric pressure; directing said laser beam onto a portion of said wiring pattern to be cut; and detecting, before said laser beam directing step, the position of said substrate on said placing means and moving said laser beam radiating means to permit said laser beam to be directed onto said portion of the wiring pattern to be cut.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-29 | 1989-01-28 | 1989-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-29 | 1993-01-28 | 1993-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-29 | 1997-01-28 | 1997-07-30 | $7700.00 | Window Closed / Lapsed |