Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
97 words
A process for forming a coating on a substrate which comprises admixing a heat curable composition comprising (1) an epoxy resin containing at least two ##STR9## (2) a thermal initiator selected from the group consisting of diaryliodonium salts and diaryliodonium salts in combination with a pinacol, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, and mixtures thereof, coating said admixture on a substrate and heating said coating in the range 70°-200° C. to effect curing.
Claim 2
Dependent Claim
97 words
A process for forming a coating on a substrate which comprises admixing a heat curable composition comprising (1) an epoxy resin containing at least two ##STR9## (2) a thermal initiator selected from the group consisting of diaryliodonium salts and diaryliodonium salts in combination with a pinacol, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, and mixtures thereof, coating said admixture on a substrate and heating said coating in the range 70°-200° C. to effect curing.
Claim 3
Dependent Claim
16 words
The process according to claim 1 wherein the heating step is carried out by electromagnetic heating.
Claim 4
Dependent Claim
14 words
The process according to claim 2 wherein the electromagnetic heating is by dielectric heating.
Claim 5
Dependent Claim
14 words
The process according to claim 2 wherein the electromagnetic heating is by induction heating.
Claim 6
Dependent Claim
9 words
A sealant resulting from the process of claim 1.
Claim 7
Dependent Claim
9 words
An adhesive resulting from the process of claim 1.
Claim 8
Dependent Claim
133 words
A process for adhering two substrates which comprises contacting said substrates with a solid, heat curable composition comprising (1) an epoxy resin containing at least two ##STR10## (2) a thermal initiator selected from the group consisting of diaryliodonium salts and diaryliodonium salts in combination with a pinacol, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, and mixtures thereof, heating said composition to a temperature whereas said composition becomes sufficiently plastic to act as a thermoplastic adhesive between said substrates, said temperature being below the decomposition temperature of the thermal initiator and thereafter heating to a higher temperature, sufficient to decompose the thermal initiator and form a thermoset adhesive between the substrates.
Claim 9
Dependent Claim
133 words
A process for adhering two substrates which comprises contacting said substrates with a solid, heat curable composition comprising (1) an epoxy resin containing at least two ##STR10## (2) a thermal initiator selected from the group consisting of diaryliodonium salts and diaryliodonium salts in combination with a pinacol, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, and mixtures thereof, heating said composition to a temperature whereas said composition becomes sufficiently plastic to act as a thermoplastic adhesive between said substrates, said temperature being below the decomposition temperature of the thermal initiator and thereafter heating to a higher temperature, sufficient to decompose the thermal initiator and form a thermoset adhesive between the substrates.