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Dry-etching process

Assignee: AGC Inc
•
Filing: 1984-10-04
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Granted: 1986-04-08
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Expires: 2004-10-04
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Abstract

Abstract A dry-etching process comprising dry-etching treatment of semiconductor material by action of a gas and, if necessary, cleaning treatment, characterized in that at least one of the dry-etching and cleaning treatments is conducted under action of a gas composed essentially of a fluorinated ether.

Inventors

  • 👤 Makoto Senoue
  • 👤 Kunihiko Terase
  • 👤 Shinya Iida
  • 👤 Hideo Komatsu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 09:41
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/20; H10P70/27; H10P70/273; H10P50/00; H10P50/20; H10P50/24; H10P50/242; H10P50/26; H10P50/264; H10P50/266; H10P50/267; H10P50/268; H10P50/28; H10P50/282; H10P50/283; Y; Y10; Y10S; Y10S438/00; Y10S438/906

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 35 words
A dry-etching process comprising a dry-etching treatment of a semiconductor material by action of a gas, characterized in that the dry-etching treatment is conducted under action of a gas composed essentially of a fluorinated ether.
Claim 2
Dependent Claim 35 words
A dry-etching process comprising a dry-etching treatment of a semiconductor material by action of a gas, characterized in that the dry-etching treatment is conducted under action of a gas composed essentially of a fluorinated ether.
Claim 3
Dependent Claim 14 words
The dry-etching process according to claim 1, wherein the fluorinated ether is a perfluoroepoxide.
Claim 4
Dependent Claim 32 words
A dry-etching process comprising a dry-etching treatment and a cleaning treatment of a semiconductor material, wherein said cleaning treatment is conducted under action of a gas composed essentially of a fluorinated ether.
Claim 5
Dependent Claim 32 words
A dry-etching process comprising a dry-etching treatment and a cleaning treatment of a semiconductor material, wherein said cleaning treatment is conducted under action of a gas composed essentially of a fluorinated ether.
Claim 6
Dependent Claim 41 words
The dry-etching process according to claim 3, wherein the dry-etching treatment is conducted under action of a gas composed essentially of a halogenated hydrocarbon, and the cleaning treatment is conducted under action of a gas composed essentially of a fluorinated ether.
Claim 7
Dependent Claim 27 words
The dry-etching process according to claim 3, wherein the dry-etching and cleaning treatments are conducted simultaneously under action of a gas composed essentially of a fluorinated ether.
Claim 8
Dependent Claim 25 words
The dry-etching process according to claims 1 or 3, wherein the gas composed essentially of a fluorinated ether, contains Cl 2 or a halogenated hydrocarbon.
Claim 9
Dependent Claim 18 words
The process according to claims 1 or 3, wherein additional etching gases are used with said fluorinated ether.
Claim 10
Dependent Claim 23 words
The process according to claims 1 or 3, wherein said fluorinated ether is selected from the group consisting of ##STR3## and mixtures thereof.
Claim 11
Dependent Claim 12 words
The process according to claim 8, wherein said fluorinated ether is ##STR4##

References Cited (Backward Citations)

US4260649A Cited
US4308089A Cited
US4372807A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-04-07 1989-10-07 1990-04-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-04-07 1993-10-07 1994-04-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-04-07 1997-10-07 1998-04-08 $7700.00 Window Closed / Lapsed

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