Patent US2585149A successfully refreshed from Google Patents.
Patent US4590672A successfully refreshed from Google Patents.
US4590672A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for electronic device and method for producing same
Assignee: Fujitsu Ltd
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Filing: 1982-07-20
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Granted: 1986-05-27
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Expires: 2002-07-20
Abstract
Abstract A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.
Inventors
- 👤 Shokichi Shimizu
- 👤 Hideji Aoki
- 👤 Susumu Kida
- 👤 Yuki Kanazawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 22:07
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/00; H10W70/40; H10W70/456; H10W70/457; H10W95/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/59; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12361; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12868; Y10T428/12875; Y10T428/12889
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
116 words
A process of producing a package having an enclosure for accommodating an electronic device, comprising the steps of: electroplating a layer of a metal selected from the platinum group metals as an underplate on the outerlead area of an iron and nickel-containing alloy lead frame, excluding the end portion of the innerlead area thereof; electroplating a layer of gold or silver as a final layer on said underplate; bonding said electronic device in the enclosure; connecting said electronic device with said end portion of the innerlead area by means of wires; and thereafter, sealing the enclosure with fused glass in such a manner that said outerlead area of said lead frame extends out of said glass.
Claim 2
Dependent Claim
116 words
A process of producing a package having an enclosure for accommodating an electronic device, comprising the steps of: electroplating a layer of a metal selected from the platinum group metals as an underplate on the outerlead area of an iron and nickel-containing alloy lead frame, excluding the end portion of the innerlead area thereof; electroplating a layer of gold or silver as a final layer on said underplate; bonding said electronic device in the enclosure; connecting said electronic device with said end portion of the innerlead area by means of wires; and thereafter, sealing the enclosure with fused glass in such a manner that said outerlead area of said lead frame extends out of said glass.
Claim 3
Dependent Claim
15 words
A process according to claim 1, wherein said underplate is a layer electroplated with rhodium.
Claim 4
Dependent Claim
35 words
The process of claim 1, wherein said underplate extends within said glass and the final layer of gold or silver is electroplated only on an end portion of the outerlead area of the lead frame.
Claim 5
Dependent Claim
74 words
An iron and nickel-containing alloy lead frame for a package of an electronic device, comprising an innerlead area for locating within the package and an outerlead area for locating outside of the package said outerlead area having at least a final layer electroplated with gold or silver on an underplate which is electroplated with a metal selected from the platinum group metals on said outerlead area, excluding the end portion of said innerlead area.
Claim 6
Dependent Claim
74 words
An iron and nickel-containing alloy lead frame for a package of an electronic device, comprising an innerlead area for locating within the package and an outerlead area for locating outside of the package said outerlead area having at least a final layer electroplated with gold or silver on an underplate which is electroplated with a metal selected from the platinum group metals on said outerlead area, excluding the end portion of said innerlead area.
Claim 7
Dependent Claim
16 words
A lead frame according to claim 4, wherein said underplate is a layer electroplated with rhodium.
Claim 8
Dependent Claim
24 words
The lead frame of claim 4, wherein the outerlead area has only an end portion electroplated with the final layer of gold or silver.
Claim 9
Dependent Claim
81 words
A package for an electronic device, comprising an iron and nickel-containing alloy lead frame of which outerleads have at least a final layer electroplated with gold or silver and of which innerleads are partially embedded in glass, said final layer on the outerleads extending within the glass, said final layer having an underplate which is electroplated with a metal selected from the platinum group metals on said outerleads, excluding the end portion of said innerleads, said underplate extending within the glass.
Claim 10
Dependent Claim
81 words
A package for an electronic device, comprising an iron and nickel-containing alloy lead frame of which outerleads have at least a final layer electroplated with gold or silver and of which innerleads are partially embedded in glass, said final layer on the outerleads extending within the glass, said final layer having an underplate which is electroplated with a metal selected from the platinum group metals on said outerleads, excluding the end portion of said innerleads, said underplate extending within the glass.
Claim 11
Dependent Claim
15 words
A package according to claim 7, wherein said underplate is a layer electroplated with rhodium.
Claim 12
Dependent Claim
24 words
A package according to claim 7, wherein the final layer of gold or silver is electroplated only on an end portion of the outerleads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-05-26 | 1989-11-25 | 1990-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-05-26 | 1993-11-25 | 1994-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-05-26 | 1997-11-25 | 1998-05-27 | $7700.00 | Window Closed / Lapsed |