Patent US4635373A successfully refreshed from Google Patents.
US4635373A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer conveying apparatus with alignment mechanism
Assignee: Canon Inc
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Filing: 1985-09-04
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Granted: 1987-01-13
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Expires: 2005-09-04
Abstract
Abstract A wafer pre-alignment apparatus including a mechanical pre-alignment device for positioning a wafer on the basis of an outer periphery configuration of the wafer, an image processing pre-alignment device for positioning the wafer on the basis of a pattern of an image formed on the wafer the image processing aligner being effective to perform the pre-alignment operation with a higher accuracy than the mechanical aligner, and a selector for operating the apparatus selectively in a first mode wherein the mechanical aligner only is operated for the wafer and in a second mode wherein the image processing aligner only is operated for the wafer, or the mechanical aligner and the image processing aligner are operated sequentially for the wafer.
Inventors
- 👤 Makoto Miyazaki
- 👤 Minoru Yomoda
- 👤 Takehiko Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 12:07
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70691; G03F7/70733; G03F7/7075
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
91 words
A wafer pre-alignment apparatus, comprising: first positioning means for positioning a wafer on the basis of an outer periphery configuration of the wafer; second positioning means for positioning the wafer on the basis of a pattern of an image formed on the wafer; and means for operating said apparatus selectively in a first mode wherein only said first positioning means positions the wafer and in a second mode wherein only said second positioning means positions the wafer, or said first positioning means and said second positioning means sequentially position the wafer.
Claim 2
Dependent Claim
91 words
A wafer pre-alignment apparatus, comprising: first positioning means for positioning a wafer on the basis of an outer periphery configuration of the wafer; second positioning means for positioning the wafer on the basis of a pattern of an image formed on the wafer; and means for operating said apparatus selectively in a first mode wherein only said first positioning means positions the wafer and in a second mode wherein only said second positioning means positions the wafer, or said first positioning means and said second positioning means sequentially position the wafer.
Claim 3
Dependent Claim
49 words
A wafer pre-alignment apparatus according to claim 1, wherein said operating means includes means for discriminating whether or not the wafer has the pattern of the image thereon and is effective to operate said apparatus in the first mode when said discriminating means discriminates the absence of the pattern.
Claim 4
Dependent Claim
58 words
A wafer pre-alignment apparatus according to claim 1, wherein said operating means is responsive to an identification number on a wafer or an input to a keyboard, in response to which said operating means discriminates whether or not a high accuracy positioning operation is required, and when it is not required, said operating means selects the first mode.
Claim 5
Dependent Claim
30 words
A wafer pre-alignment apparatus according to any one of claims 1-3, wherein said first positioning means and said second positioning means are operated at one end and the same position.
Claim 6
Dependent Claim
20 words
A wafer pre-alignment apparatus according to any one of claim 1, wherein said first positioning means mechanically aligning the wafer.
Claim 7
Dependent Claim
63 words
A wafer pre-alignment apparatus, comprising: means for sensing an image of an outer periphery configuration of a wafer carried on a stage; means for determining a deviation of the wafer from a reference position in accordance with the image of the outer periphery configuration sensed by said sensing means; and stage control means responsive to said determining means for correctly positioning the wafer.
Claim 8
Dependent Claim
63 words
A wafer pre-alignment apparatus, comprising: means for sensing an image of an outer periphery configuration of a wafer carried on a stage; means for determining a deviation of the wafer from a reference position in accordance with the image of the outer periphery configuration sensed by said sensing means; and stage control means responsive to said determining means for correctly positioning the wafer.
Claim 9
Dependent Claim
53 words
A wafer pre-alignment apparatus according to claim 6, wherein said determining means determines a position of the center of the wafer on the basis of image data of the outer periphery of the wafer without an orientation flat thereof, and determines the deviation on the basis of the determined position of the center.
Claim 10
Dependent Claim
44 words
A wafer pre-alignment apparatus according to claim 6 or 7, wherein the deviation is defined by a translational deviation of the center of the wafer from the reference position and an angular deviation of an orientation flat of the wafer from a reference line.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-01-12 | 1990-07-14 | 1991-01-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-01-12 | 1994-07-14 | 1995-01-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-01-12 | 1998-07-14 | 1999-01-13 | $7700.00 | Window Closed / Lapsed |