US4639142A
Expired / Lapsed
US
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Dimension monitoring technique for semiconductor fabrication
Assignee: Newport Fab LLC
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Filing: 1983-04-13
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Granted: 1987-01-27
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Expires: 2003-04-13
Abstract
Abstract A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing is provided. A fixed pattern of scale images on the surface with a predetermined distance between images, together with a wedge-shaped element is provided on the surface. The wedge element has an apex adjacent one of the images and extends in a direction along other ones of the images. The semiconductor body is processed and the dimensions of the wedge-shaped element (as well as the scale image) change. One may then subsequently visually inspect the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of the wedge shaped element during processing.
Inventors
- 👤 Pei-Ming D. Chow
- 👤 Keh-Fei C. Chi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 00:36
CPC Classifications
G; G01; G01B; G01B11/00; G01B11/02
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
114 words
A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising the steps of: providing a fixed pattern of images on said surface having a predetermined distance between said images; providing a wedge-shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images; processing said semiconductor body in a predetermined manner causing the dimensions of said wedge-shaped element to change; subsequently visually inspecting the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of said wedge shaped element during processing.
Claim 2
Independent Claim
114 words
A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising the steps of: providing a fixed pattern of images on said surface having a predetermined distance between said images; providing a wedge-shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images; processing said semiconductor body in a predetermined manner causing the dimensions of said wedge-shaped element to change; subsequently visually inspecting the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of said wedge shaped element during processing.
Claim 3
Dependent Claim
75 words
A mask for use in semiconductor processing for producing a test pattern for visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising: a fixed scale pattern of images on said surface having a predetermined distance between said images; and a wedge shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images.
Claim 4
Dependent Claim
75 words
A mask for use in semiconductor processing for producing a test pattern for visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising: a fixed scale pattern of images on said surface having a predetermined distance between said images; and a wedge shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images.
Claim 5
Dependent Claim
20 words
A mask as defined in claim 2, wherein said scale pattern is composed of diamond shaped marks spaced equally apart.
Claim 6
Dependent Claim
15 words
A mask as defined in claim 2, wherein said wedge shaped element is a trapezoid.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-01-26 | 1990-07-28 | 1991-01-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-01-26 | 1994-07-28 | 1995-01-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-01-26 | 1998-07-28 | 1999-01-27 | $7700.00 | Window Closed / Lapsed |