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Dimension monitoring technique for semiconductor fabrication

Assignee: Newport Fab LLC
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Filing: 1983-04-13
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Granted: 1987-01-27
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Expires: 2003-04-13
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Abstract

Abstract A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing is provided. A fixed pattern of scale images on the surface with a predetermined distance between images, together with a wedge-shaped element is provided on the surface. The wedge element has an apex adjacent one of the images and extends in a direction along other ones of the images. The semiconductor body is processed and the dimensions of the wedge-shaped element (as well as the scale image) change. One may then subsequently visually inspect the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of the wedge shaped element during processing.

Inventors

  • 👤 Pei-Ming D. Chow
  • 👤 Keh-Fei C. Chi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 01:19
CPC Classifications
G; G01; G01B; G01B11/00; G01B11/02

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 114 words
A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising the steps of: providing a fixed pattern of images on said surface having a predetermined distance between said images; providing a wedge-shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images; processing said semiconductor body in a predetermined manner causing the dimensions of said wedge-shaped element to change; subsequently visually inspecting the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of said wedge shaped element during processing.
Claim 2
Independent Claim 114 words
A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising the steps of: providing a fixed pattern of images on said surface having a predetermined distance between said images; providing a wedge-shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images; processing said semiconductor body in a predetermined manner causing the dimensions of said wedge-shaped element to change; subsequently visually inspecting the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of said wedge shaped element during processing.
Claim 3
Dependent Claim 75 words
A mask for use in semiconductor processing for producing a test pattern for visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising: a fixed scale pattern of images on said surface having a predetermined distance between said images; and a wedge shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images.
Claim 4
Dependent Claim 75 words
A mask for use in semiconductor processing for producing a test pattern for visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing thereof comprising: a fixed scale pattern of images on said surface having a predetermined distance between said images; and a wedge shaped element on said surface having an apex adjacent one of said images and extending in a direction along other ones of said images.
Claim 5
Dependent Claim 20 words
A mask as defined in claim 2, wherein said scale pattern is composed of diamond shaped marks spaced equally apart.
Claim 6
Dependent Claim 15 words
A mask as defined in claim 2, wherein said wedge shaped element is a trapezoid.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-01-26 1990-07-28 1991-01-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-01-26 1994-07-28 1995-01-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-01-26 1998-07-28 1999-01-27 $7700.00 Window Closed / Lapsed

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