Patent US4644093A successfully refreshed from Google Patents.
US4644093A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board
Assignee: Toshiba Corp
•
Filing: 1985-10-17
•
Granted: 1987-02-17
•
Expires: 2005-10-17
Abstract
Abstract A circuit board comprises a substrate made of a semi-insulating or insulating material, an insulating layer formed on the substrate and having a lower dielectric constant than the dielectric constant of the substrate, and a plurality of wiring conductors formed at predetermined intervals on the insulating layer. The insulating layer has a thickness determined according to the distance between adjacent wiring conductors and equal to 0.5 to 2.5 times the distance noted above, for the purpose of reducing cross-talk noise.
Inventors
- 👤 Kunio Yoshihara
- 👤 Toshio Sudo
- 👤 Atsuko Iida
- 👤 Takeshi Miyagi
- 👤 Tamio Saito
- 👤 Shigeyuki Oe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 06:02
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W70/698
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
89 words
A circuit board on which an integrated circuit is fabricated, comprising: a substrate made of one of semi-insulating and insulating materials, and having a predetermined dielectric constant; an insulating layer formed on said substrate and made of an insulating material having a lower dielectric constant than the dielectric constant of said substrate; and a plurality of parallel wiring conductors formed at predetermined intervals on said insulating layer; said insulating layer having a thickness equal to 0.5 to 2.5 times the distance between adjacent wiring conductors to reduce cross-talk noise.
Claim 2
Dependent Claim
89 words
A circuit board on which an integrated circuit is fabricated, comprising: a substrate made of one of semi-insulating and insulating materials, and having a predetermined dielectric constant; an insulating layer formed on said substrate and made of an insulating material having a lower dielectric constant than the dielectric constant of said substrate; and a plurality of parallel wiring conductors formed at predetermined intervals on said insulating layer; said insulating layer having a thickness equal to 0.5 to 2.5 times the distance between adjacent wiring conductors to reduce cross-talk noise.
Claim 3
Dependent Claim
31 words
The circuit board according to claim 1, wherein said substrate is made of semi-insulating GaAs, said insulating layer is made of SiO 2 , and said wiring conductors are metallic conductors.
Claim 4
Dependent Claim
15 words
The circuit board according to claim 1, wherein said substrate is made of alumina ceramics.
Claim 5
Dependent Claim
15 words
The circuit board according to claim 1, wherein said insulating layer is made of polyimide.
Claim 6
Dependent Claim
15 words
The circuit board according to claim 1, wherein said insulating layer is made of polytetrafluoroethylene.
Claim 7
Dependent Claim
17 words
The circuit board according to claim 1, wherein a GaAs integrated circuit is fabricated on said substrate.
Claim 8
Dependent Claim
20 words
The circuit board according to claim 6, wherein said GaAs integrated circuit is a direct-coupled field effect transistor logic circuit.
Claim 9
Dependent Claim
17 words
The circuit board according to claim 1, wherein a hybrid integrated circuit is formed on said substrate.
Claim 10
Dependent Claim
80 words
The circuit board comprising: a substrate made of a semi-insulating GaAs and having a predetermined dielectric constant; an insulating layer formed on said substrate and made of one of SiO 2 and SiN, which have a lower dielectric constant than the dielectric constant of said substrate; and a plurality of parallel wiring metallic conductors formed at predetermined intervals on said insulating layer, said insulating layer having a thickness equal to 0.5 to 1.5 times the distance between adjacent wiring conductors.
Claim 11
Dependent Claim
80 words
The circuit board comprising: a substrate made of a semi-insulating GaAs and having a predetermined dielectric constant; an insulating layer formed on said substrate and made of one of SiO 2 and SiN, which have a lower dielectric constant than the dielectric constant of said substrate; and a plurality of parallel wiring metallic conductors formed at predetermined intervals on said insulating layer, said insulating layer having a thickness equal to 0.5 to 1.5 times the distance between adjacent wiring conductors.
Claim 12
Dependent Claim
29 words
The circuit board according to claim 1, wherein said substrate is made of semi-insulating GaAs, said insulating layer is made of polyimide, and said wiring conductors are metallic conductors.
References Cited (Backward Citations)
US3179904A
Cited
US3634782A
Cited
US4475006A
Cited
GB2097998A
Cited
US4423282A
Cited
US4441088A
Cited
US4498122A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-16 | 1990-08-18 | 1991-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-16 | 1994-08-18 | 1995-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-16 | 1998-08-18 | 1999-02-17 | $7700.00 | Window Closed / Lapsed |