Patent US4289364A successfully refreshed from Google Patents.
Patent US4657172A successfully refreshed from Google Patents.
US4657172A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method of solder coating integrated circuit leads
Assignee: AMI Semiconductor Inc
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Filing: 1985-10-31
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Granted: 1987-04-14
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Expires: 2005-10-31
Abstract
Abstract Desired control of the thickness and composition of a solder coat on the J-leads of an integrated circuit Quad package is obtained by orienting the packages while being solder coated in a "leads-up" orientation as a series of strips mounting the packages are passed through a solder wave of a wave soldering apparatus on a pallet. The Quad or other shaped integrated circuit or other electronic packages which have leads extending exteriorly thereof, thus have the critical lead crest portions coated with substantially the same solder layer thickness and composition. This permits reliable electrical connections between the crest portions of the leads and printed circuit board metal traces (metallization), particularly in surface mounting of the package to a printed circuit board. An additional feature of the invention is a pallet for holding a series of package-holding elongate frames which pallet is used for conveying the packages through the wave soldering apparatus.
Inventors
- 👤 Jong S. Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 18:44
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K3/341; H05K3/3421; H05K3/3426; H10W72/011; H10W72/0112; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10984; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
210 words
A method of precoating electrical leads extending from a surface of a discrete integrated circuit package having opposed flat top and bottom surfaces and where the electrical leads each have a first portion extending from a peripheral edge of the package and a second portion extending to a position adjacent to one of said top and bottom surfaces of said integrated circuit package, said second portion including a first surface to be precoated with solder for subsequent and separate connection to a printed circuit board comprising: providing a container having a level of molten solder therein; intermittently discharging a wave of molten solder in said container above said level of molten solder; orienting said integrated circuit package with respect to said level of molten solder in a plane intersecting said wave of molten solder; orienting the said integrated circuit package so that said electrical leads second portion extends in a direction upward and away from said level of molten solder and said first surface to be precoated extends exposed in a plane adjacent to said package; and passing said so-oriented integrated circuit package including said first surface through said wave of molten solder to precoat each of said first surfaces of said electrical leads with essentially uniform thicknesses of solder.
Claim 2
Independent Claim
210 words
A method of precoating electrical leads extending from a surface of a discrete integrated circuit package having opposed flat top and bottom surfaces and where the electrical leads each have a first portion extending from a peripheral edge of the package and a second portion extending to a position adjacent to one of said top and bottom surfaces of said integrated circuit package, said second portion including a first surface to be precoated with solder for subsequent and separate connection to a printed circuit board comprising: providing a container having a level of molten solder therein; intermittently discharging a wave of molten solder in said container above said level of molten solder; orienting said integrated circuit package with respect to said level of molten solder in a plane intersecting said wave of molten solder; orienting the said integrated circuit package so that said electrical leads second portion extends in a direction upward and away from said level of molten solder and said first surface to be precoated extends exposed in a plane adjacent to said package; and passing said so-oriented integrated circuit package including said first surface through said wave of molten solder to precoat each of said first surfaces of said electrical leads with essentially uniform thicknesses of solder.
Claim 3
Dependent Claim
24 words
The method of claim 1 in which said integrated circuit package is passed through said wave of molten solder along an inclined upward plane.
Claim 4
Dependent Claim
54 words
The method of claim 1 further comprising mounting a series of integrated circuit packages in a pallet; and orienting said series of integrated circuit packages in a parallel direction to a crest of said wave of molten solder such that said series of integrated circuit packages simultaneously pass through said wave of molten solder.
Claim 5
Dependent Claim
60 words
The method of claim 3 further comprising: mounting a series of integrated circuit packages in a multiple package frame; orienting each of the packages in a plane intersecting said wave of molten solder and in a direction upwards and away from level of molten solder; and passing said series of integrated circuit package simultaneously through said wave of molten solder.
Claim 6
Dependent Claim
48 words
The method of claim 4 further comprising: mounting a series of multiple package frames containing integrated circuit packages transversely of an elongated pallet; and passing said pallet through said wave of molten solder to successively solder coat each electrical lead of each package in each multiple package frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-13 | 1990-10-13 | 1991-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-13 | 1994-10-13 | 1995-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-13 | 1998-10-13 | 1999-04-14 | $7700.00 | Window Closed / Lapsed |