Patent US2591245A successfully refreshed from Google Patents.
Patent US4724040A successfully refreshed from Google Patents.
US4724040A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for producing electric circuits on a base boad
Assignee: Asahi Chemical Research Laboratory Co Ltd
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Filing: 1986-12-11
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Granted: 1988-02-09
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Expires: 2006-12-11
Abstract
Abstract A method is described for producing multilayer circuits including a resistor circuit on one side of a copper laminated base board, wherein the base board is etched to provide a plurality of circuits of a first layer, effectively processed with a plating-resistant resist and an electrically conductive copper paste to form a plurality of circuits of a second layer, immersed in a metal plating solution to provide a metal plating layer on the copper paste to thereby form the circuits of the second layer on the circuits of the first layer, coated with an electrically conductive paste to provide a pair of electric terminals between two of the circuits of the second layer, and coated with an electrically resistant resist of a predetermined electric resistance value on a part extended between the two electric terminals.
Inventors
- 👤 Yamahiro Iwasa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 07:19
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K1/00; H05K1/16; H05K1/162; H05K3/46; H05K3/4644; H05K3/4664; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K1/167; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09763; H05K3/4685; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
311 words
A method for forming electric circuits on a base board comprising the steps of: (a) attaching a copper lamination to one side of the base board; (b) etching copper lamination to form thereon a plurality of first electrically conductive circuits of a first lamination layer; (c) coating said one side of the base board with a plating-resistant resist except the portions which are required to be electrically connected to other circuits to be formed on the first electrically conductive circuits of the first lamination layer; (d) coating an electrically conductive copper paste of being adapted to a metal plating on said one side of the base board in a manner that the first electrically conductive circuits of the first lamination layer may be divided into at least two portions to be electrically isolated from each other; (e) heating the base board to harden the so processed base board; (f) cleansing the base board; (g) immersing the base board in a metal plating solution to provide a metal plating layer on the face of the electrically conductive copper paste so as to form second electrically conductive circuits of at least two electrically isolated portions of a second lamination layer which are composed of the metal plating layer and the electrically conductive copper paste; (h) coating an electrically conductive paste on a part of each of the electrically isolated portions of the second electrically conductive circuits of the second lamination layer; (i) heating the base board to harden the electrically conductive paste to form a pair of electric terminals; (j) coating an electrically resistant paste of a predetermined resistance value on a part extending between the two electric terminals; and (k) heating the base board to harden the electrically resistant paste to form a resistor circuit between the two electrically isolated portions of the second electrically conductive circuits of the second lamination layer.
Claim 2
Independent Claim
311 words
A method for forming electric circuits on a base board comprising the steps of: (a) attaching a copper lamination to one side of the base board; (b) etching copper lamination to form thereon a plurality of first electrically conductive circuits of a first lamination layer; (c) coating said one side of the base board with a plating-resistant resist except the portions which are required to be electrically connected to other circuits to be formed on the first electrically conductive circuits of the first lamination layer; (d) coating an electrically conductive copper paste of being adapted to a metal plating on said one side of the base board in a manner that the first electrically conductive circuits of the first lamination layer may be divided into at least two portions to be electrically isolated from each other; (e) heating the base board to harden the so processed base board; (f) cleansing the base board; (g) immersing the base board in a metal plating solution to provide a metal plating layer on the face of the electrically conductive copper paste so as to form second electrically conductive circuits of at least two electrically isolated portions of a second lamination layer which are composed of the metal plating layer and the electrically conductive copper paste; (h) coating an electrically conductive paste on a part of each of the electrically isolated portions of the second electrically conductive circuits of the second lamination layer; (i) heating the base board to harden the electrically conductive paste to form a pair of electric terminals; (j) coating an electrically resistant paste of a predetermined resistance value on a part extending between the two electric terminals; and (k) heating the base board to harden the electrically resistant paste to form a resistor circuit between the two electrically isolated portions of the second electrically conductive circuits of the second lamination layer.
Claim 3
Dependent Claim
15 words
The method as defined in claim 1, wherein the base board is made of polymer.
Claim 4
Dependent Claim
15 words
The method as defined in claim 1, wherein metal plating is a chemical copper plating.
Claim 5
Dependent Claim
55 words
The method as defined in claim 1, wherein one of said at least two electrically isolated portions of the first electrically conductive circuits includes at least two circuits electrically connected to each other, and the other of said at least two electrically isolated portions of the first electrically conductive circuits includes at least one circuit.
Claim 6
Dependent Claim
55 words
The method as defined in claim 1, wherein one of said at least two electrically isolated portions of the second electrically conductive circuits includes at least two circuits electrically connected to each other, and the other of said at least two electrically isolated portions of the second electrically conductive circuits includes at least one circuit.
Claim 7
Independent Claim
308 words
A method for forming electric circuits on a base board comprising the steps of: (a) attaching a copper lamination to one side of the base board; (b) etching the copper lamination to form thereon a plurality of first electrically conductive circuits of a first lamination layer; (c) coating said one side of the base board with a plating-resistant resist except the portions which are required to be electrically connected to another circuit to be formed on the first electrically conductive circuits of the first lamination layer; (d) coating an electrically conductive copper paste of being adapted to a metal plating on said one side of the base board in a manner that at least two of the first electrically conductive circuits may be electrically connected; (e) heating the base board to harden the base board; (f) cleansing the base board; (g) immersing the base board in a metal plating solution to provide a metal plating layer on the face of the electrically conductive paste so as to form at least one second electrically conductive circuit of a second lamination layer which is composed of the metal plating layer and the electrically conductive copper paste; (h) coating a dielectric paste having a property of storing electricity on the remain of the first electrically conductive circuits remained without the electrically conductive copper past coated thereon or on a part of the second electrically conductive circuit; (i) heating the base board to harden the dielectric paste; (j) coating said one side of the base board with an electrically conductive paste in a manner that the electrically conductive paste will extend between the dielectric paste and one of the first electrically conductive circuits, or said second electrically conductive circuit; and (k) heating the base board to harden the electrically conductive paste to thereby form an electricity storing circuit on the base board.
Claim 8
Independent Claim
308 words
A method for forming electric circuits on a base board comprising the steps of: (a) attaching a copper lamination to one side of the base board; (b) etching the copper lamination to form thereon a plurality of first electrically conductive circuits of a first lamination layer; (c) coating said one side of the base board with a plating-resistant resist except the portions which are required to be electrically connected to another circuit to be formed on the first electrically conductive circuits of the first lamination layer; (d) coating an electrically conductive copper paste of being adapted to a metal plating on said one side of the base board in a manner that at least two of the first electrically conductive circuits may be electrically connected; (e) heating the base board to harden the base board; (f) cleansing the base board; (g) immersing the base board in a metal plating solution to provide a metal plating layer on the face of the electrically conductive paste so as to form at least one second electrically conductive circuit of a second lamination layer which is composed of the metal plating layer and the electrically conductive copper paste; (h) coating a dielectric paste having a property of storing electricity on the remain of the first electrically conductive circuits remained without the electrically conductive copper past coated thereon or on a part of the second electrically conductive circuit; (i) heating the base board to harden the dielectric paste; (j) coating said one side of the base board with an electrically conductive paste in a manner that the electrically conductive paste will extend between the dielectric paste and one of the first electrically conductive circuits, or said second electrically conductive circuit; and (k) heating the base board to harden the electrically conductive paste to thereby form an electricity storing circuit on the base board.
Claim 9
Dependent Claim
15 words
The method as defined in claim 6, wherein the base board is made of polymer.
Claim 10
Dependent Claim
16 words
The method as defined in claim 6, wherein the metal plating is a chemical copper plating.
Claim 11
Dependent Claim
21 words
The method as defined in claim 6, wherein said other of the first electrically conductive circuits includes at least one circuit.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-02-08 | 1991-08-10 | 1992-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-02-08 | 1995-08-10 | 1996-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-02-08 | 1999-08-10 | 2000-02-09 | $7700.00 | Window Closed / Lapsed |