US4761880A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of obtaining surface mount component planarity
Assignee: International Business Machines Corp
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Filing: 1986-12-08
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Granted: 1988-08-09
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Expires: 2006-12-08
Abstract
Abstract A packaging technique for finely leaded electronic devices for attachment by surface methods to printed circuit boards is disclosed wherein the leads are imbedded in solder foil prior to the completion of lead forming operations so as to maintain planarity of the leads and to prevent damage thereto during handling, placement and attachment processes.
Inventors
- 👤 John J. Stankus
- 👤 Boyd M. Fry
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10924; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/04; H05K2203/0405; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
49 words
A method of insuring lead planarity in leaded surface mountable components comprising sequentially: applying by pressure forming a web of electrically conductive material to the leads prior to their separation from a matrix of lead material; shaping leads into a predetermined configuration; and removing the excess lead material matrix.
Claim 2
Independent Claim
49 words
A method of insuring lead planarity in leaded surface mountable components comprising sequentially: applying by pressure forming a web of electrically conductive material to the leads prior to their separation from a matrix of lead material; shaping leads into a predetermined configuration; and removing the excess lead material matrix.
Claim 3
Dependent Claim
19 words
The method of claim 1 wherein the applying step includes: cold forming the web onto and around the leads.
Claim 4
Independent Claim
14 words
The method of claims 1 or 2 wherein the web is a solder foil.
Claim 5
Independent Claim
36 words
A method of applying solder to leaded components comprising the sequential steps of: (a) cold pressure forming a web of solder onto the leads attached to lead frame material; and (b) removing the lead frame material.
Claim 6
Independent Claim
36 words
A method of applying solder to leaded components comprising the sequential steps of: (a) cold pressure forming a web of solder onto the leads attached to lead frame material; and (b) removing the lead frame material.
Claim 7
Dependent Claim
20 words
The method of claim 4 including the additional step of: forming the leads into a predetermined configuration before step (a).
Claim 8
Dependent Claim
20 words
The method of claim 4, including the additional step of: forming the leads into a predetermined configuration before step (b).
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-09 | 1992-02-08 | 1992-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-09 | 1996-02-08 | 1996-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-09 | 2000-02-08 | 2000-08-09 | $7700.00 | Window Closed / Lapsed |