Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
223 words
A method for forming a shielded transmission line, comprising the steps of: forming a first insulator layer; forming a first conductor layer on a surface of said first insulator layer, and patterning said first conductor layer to form a first conductive plate structure; forming a second insulator layer on said first insulator layer and said first conductor layer; etching said second insulator layer to form troughs therein that expose end portions of said first conductive plate structure; forming a second conductor layer on said second insulator layer, said second conductor layer filling said troughs in said second insulator layer to contact said first plate structure; patterning said second conductor layer so as to define a central conductor structure and a pair of peripheral conductor structures separated from and disposed about said central conductor structure, said peripheral conductor structures being coupled to said first plate structure; forming a third insulator layer on said second insulator layer and said second conductor layer; etching said third insulator layer to form troughs therein that expose said peripheral conductor structures; depositing a third conductor layer on said third insulator layer, said third conductor layer filling said troughs in said third insulator layer to contact said peripheral conductor structures; and patterning said third conductor layer so as to form a second plate structure coupled to said peripheral conductor structure.
Claim 2
Independent Claim
223 words
A method for forming a shielded transmission line, comprising the steps of: forming a first insulator layer; forming a first conductor layer on a surface of said first insulator layer, and patterning said first conductor layer to form a first conductive plate structure; forming a second insulator layer on said first insulator layer and said first conductor layer; etching said second insulator layer to form troughs therein that expose end portions of said first conductive plate structure; forming a second conductor layer on said second insulator layer, said second conductor layer filling said troughs in said second insulator layer to contact said first plate structure; patterning said second conductor layer so as to define a central conductor structure and a pair of peripheral conductor structures separated from and disposed about said central conductor structure, said peripheral conductor structures being coupled to said first plate structure; forming a third insulator layer on said second insulator layer and said second conductor layer; etching said third insulator layer to form troughs therein that expose said peripheral conductor structures; depositing a third conductor layer on said third insulator layer, said third conductor layer filling said troughs in said third insulator layer to contact said peripheral conductor structures; and patterning said third conductor layer so as to form a second plate structure coupled to said peripheral conductor structure.
Claim 3
Dependent Claim
41 words
The method for forming a shielded transmission line as recited in claim 1, wherein said conductor structures are comprised of a material selected from the group consisting of aluminum, aluminum alloys, refractory metals, refractory metal alloys, doped polysilicon, and mixtures thereof.
Claim 4
Dependent Claim
36 words
The method for forming a shielded transmission line of claim 1, wherein said insulator layers are comprised of a material selected from the group consisting of silicon oxide, silicon nitride, polyimide, doped glass, and mixtures thereof.
Claim 5
Independent Claim
301 words
A method for forming a shielded transmission line, comprising the steps of: forming a first insulator layer; forming a first conductor layer on a surface of said first insulator layer, and patterning said first conductor layer to form a first conductive plate structure; forming a second insulator layer on said first insulator layer and said first conductor layer; forming a third insulator layer on said second insulator layer, and patterning said third insulator layer to define troughs therein; patterning portions of said second insulator layer beneath some of said troughs in said third insulator layer, to form vias in said second insulator layer; depositing a second conductor layer to fill said troughs in said third insulator layer and said vias in said second insulator layer, so as to define a central conductor structure and a pair of peripheral conductor structures within said troughs in said third insulator layer, said peripheral conductor structures being separated from and disposed about said central conductor structure, said peripheral conductor structures being coupled to said first plate structure through said vias in said second insulator layer; forming a fourth insulator layer on said third insulator layer and on said second conductor layer; forming a fifth insulator layer on said fourth insulator layer, and patterning said fifth insulator layer to define troughs therein; patterning portions of said fourth insulator layer beneath some of said troughs in said fifth insulator layer to form vias in said fourth insulator layer; depositing a third conductor layer to fill said troughs in said fifth insulator layer and said vias in said fourth insulator layer, so as to define a second conductive plate structure in said fifth insulator layer peripheral portions of said second conductive plate structure being coupled to said peripheral conductor structures through said vias in said fourth insulator layer
Claim 6
Independent Claim
301 words
A method for forming a shielded transmission line, comprising the steps of: forming a first insulator layer; forming a first conductor layer on a surface of said first insulator layer, and patterning said first conductor layer to form a first conductive plate structure; forming a second insulator layer on said first insulator layer and said first conductor layer; forming a third insulator layer on said second insulator layer, and patterning said third insulator layer to define troughs therein; patterning portions of said second insulator layer beneath some of said troughs in said third insulator layer, to form vias in said second insulator layer; depositing a second conductor layer to fill said troughs in said third insulator layer and said vias in said second insulator layer, so as to define a central conductor structure and a pair of peripheral conductor structures within said troughs in said third insulator layer, said peripheral conductor structures being separated from and disposed about said central conductor structure, said peripheral conductor structures being coupled to said first plate structure through said vias in said second insulator layer; forming a fourth insulator layer on said third insulator layer and on said second conductor layer; forming a fifth insulator layer on said fourth insulator layer, and patterning said fifth insulator layer to define troughs therein; patterning portions of said fourth insulator layer beneath some of said troughs in said fifth insulator layer to form vias in said fourth insulator layer; depositing a third conductor layer to fill said troughs in said fifth insulator layer and said vias in said fourth insulator layer, so as to define a second conductive plate structure in said fifth insulator layer peripheral portions of said second conductive plate structure being coupled to said peripheral conductor structures through said vias in said fourth insulator layer